Michael Grillberger
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Publication
Featured researches published by Michael Grillberger.
IEEE Transactions on Semiconductor Manufacturing | 2009
Dmytro Chumakov; Frank Lindert; Matthias Lehr; Michael Grillberger; Ehrenfried Zschech
Dual cantilever beam (DCB) mechanical testing is applied to two kinds of chips, manufactured in the 45 nm technology node. Both chips consist of different numbers of ultra low-k (ULK) dielectric layers, however, they have similarly designed crack-stop structures. It is shown that in all cases, cohesive cracking occurred in the upper ULK layers. The crack-stops hamper the crack propagation, and cracks are deflected outside the interconnect stack. The paths of the deflected crack fronts are FIB-sectioned and imaged in SEM. The increasing number of ULK layers leads to decrease in effective Gc of the stack.
Archive | 2009
Thomas Werner; Michael Grillberger; Frank Feustel
Archive | 2010
Torsten Huisinga; Michael Grillberger; Jens Hahn
Archive | 2009
Frank Feustel; Thomas Werner; Michael Grillberger; Kai Frohberg
Archive | 2010
Holm Geisler; Matthias Lehr; Frank Kuechenmeister; Michael Grillberger
Archive | 2010
Torsten Huisinga; Michael Grillberger; Frank Feustel
Archive | 2011
Michael Grillberger; Matthias Lehr; Thomas Werner
Archive | 2011
Michael Grillberger; Matthias Lehr; Frank Kuechenmeister; Steffen Koch
Archive | 2010
Dmytro Chumakov; Michael Grillberger; Heike Berthold; Katrin Reiche
Archive | 2008
Michael Grillberger; Matthias Lehr