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Michael Sugarman

Applied Materials

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Publication

Featured researches published by Michael Sugarman.

Archive | 1999

Electro-chemical deposition cell for face-up processing of single semiconductor substrates

Yezdi Dordi; Joe Stevens; Roy Edwards; Bob Lowrance; Michael Sugarman; Mark Denome

Archive | 1996

Wafer spacing mask for a substrate support chuck and method of fabricating same

Vincent E. Burkhart; Michael Sugarman; Howard Grunes

Archive | 1998

Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system

Allen Flanigan; Michael Sugarman

Archive | 2001

Method and associated apparatus for tilting a substrate upon entry for metal deposition

Yezdi Dordi; Joseph J. Stevens; Michael Sugarman

Archive | 1999

Method and apparatus for reducing thermal gradients within a substrate support

Vincent E. Burkhart; Steven V. Sansoni; Michael Sugarman; Anthony Chan

Archive | 1998

Spin-rinse-drying process for electroplated semiconductor wafers

Mark Lloyd; Ashok K. Sinha; Sergio Edelstein; Michael Sugarman

Archive | 2002

Wafer edge cleaning method and apparatus

Fred C. Redeker; Brian J. Brown; Michael Sugarman

Archive | 2005

Single wafer dryer and drying methods

Younes Achkire; Alexander N. Lerner; Boris Govzman; Boris Fishkin; Michael Sugarman; Rashid Mavliev; Haoquan Fang; Shijian Li; Guy Shirazi; Jianshe Tang

Archive | 2005

Methods and apparatus for determining scrubber brush pressure

Michael Sugarman; Vladimir Galburt

Archive | 2001

Segmenting of processing system into wet and dry areas

H. Peter W. Hey; Michael Sugarman; Mark Denome

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Alexander N. Lerner

Applied Materials

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Brian J. Brown

Applied Materials

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Yezdi Dordi

Applied Materials

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Boris Fishkin

Applied Materials

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Guy Shirazi

Applied Materials

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Haoquan Fang

Applied Materials

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John M. White

Applied Materials

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Shijian Li

Applied Materials

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Vincent E. Burkhart

Applied Materials

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Younes Achkire

Applied Materials

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