Min-Woong Seo

A Low-Noise High Intrascene Dynamic Range CMOS Image Sensor With a 13 to 19b Variable-Resolution Column-Parallel Folding-Integration/Cyclic ADC

A low temporal noise and high dynamic range CMOS image sensor is developed. A 1Mpixel CMOS image sensor with column-parallel folding-integration and cyclic ADCs has 80μV_rms (1.2e^-) temporal noise, 82 dB dynamic range using 64 samplings in the folding-integration ADC mode. Very high variable gray-scale resolution of 13b through 19b is attained by changing the number of samplings of pixel outputs. The implemented CMOS image sensor using a 0.18-μm technology has the sensitivity of 10-<i>V</i>/lx·s, the conversion gain of 67- μV/e^-, and linear digital code range of more than 4 decades.

A 0.27e-rms Read Noise 220-μV/e-Conversion Gain Reset-Gate-Less CMOS Image Sensor With 0.11-μm CIS Process

A low temporal read noise and high conversion gain reset-gate-less CMOS image sensor (CIS) has been developed and demonstrated for the first time at photoelectron-counting-level imaging. To achieve a high pixel conversion gain without fine or special processes, the proposed pixel has two unique structures: 1) coupling capacitance between the transfer gate and floating diffusion (FD) and 2) coupling capacitance between the reset gate and FD, for removing parasitic capacitances around the FD node. As a result, a CIS with the proposed pixels is able to achieve a high pixel conversion gain of 220 μV/e- and a low read noise of 0.27erms- using correlated multiple-sampling-based readout circuitry.

A Low-Noise High-Dynamic-Range 17-b 1.3-Megapixel 30-fps CMOS Image Sensor With Column-Parallel Two-Stage Folding-Integration/Cyclic ADC

A 1.3-megapixel CMOS image sensor (CIS) with digital correlated double sampling and 17-b column-parallel two-stage folding-integration/cyclic analog-to-digital converters (ADCs) is developed. The image sensor has 0.021-erms- vertical fixed pattern noise, 1.2-erms- pixel temporal noise, and 85.0-dB dynamic range using 32 samplings in the folding-integration ADC mode. Despite the large number of samplings (32 times), the prototype image sensor is demonstrated at the video rate operation of 30 Hz by the new architecture of the proposed ADCs and the high-performance peripheral logic (or digital) parts using low-voltage differential signaling circuit. The developed 17-b CIS has no visible quantization noise at very low light level of 0.01 lx because of high grayscale resolution where 1LSB = 0.1-. The implemented CIS using 0.18- μm technology has the sensitivity of 20 V/lx ·s and the pixel conversion gain of 82 μV/e-.

A Low Noise Wide Dynamic Range CMOS Image Sensor With Low-Noise Transistors and 17b Column-Parallel ADCs

An extremely low temporal noise and wide dynamic range CMOS image sensor is developed using low-noise transistors and high gray-scale resolution (17b) folding-integration/cyclic analog-to-digital converter (ADC). Two types of pixel are designed. One is a high conversion gain (HCG) pixel with removing the coupling capacitance between the transfer gate and the floating diffusion, and the other is a pixel for wide dynamic range (WDR) CMOS imager with a native transistor as a source follower amplifier. The CMOS image sensor that is in combination with the proposed pixels and the high performance column ADC has achieved a low pixel temporal noise of 1.1erms-, a wide dynamic range of 87.5 dB with the video rate operation (30 Hz) and the vertical fixed pattern noise of 1.08-μVrms. The implemented HCG CMOS imager and WDR CMOS imager using 0.18 μm technology have the pixel conversion gain of 73.2- and 22.8-μV/e-, respectively.

Gradient band gap engineered alloyed quaternary/ternary CdZnSeS/ZnSeS quantum dots: an ultrasensitive fluorescence reporter in a conjugated molecular beacon system for the biosensing of influenza virus RNA

Controlling and engineering the particle composition of semiconductor alloys is one of the topmost targets in the field of semiconductor materials science and technology. Quantum dot (QD) nanocrystals offer an unmatched opportunity to obtain a wide range of composition-controlled alloys and have captivated a great deal of interest recently. Herein, we report on band gap engineering via tuning and controlling the sulphur molar fraction (ternary shell layer) of quaternary/ternary core/shell alloyed CdZnSeS/ZnSeS QDs. Varying optical properties were exhibited by the alloyed QDs but a uniform particle size distribution was maintained across all the compositions. The alloyed QDs displayed bright emission colours under UV irradiation, whereas the photoluminescence quantum yields (PL QY) were in a remarkable range of 36-98%. Non-linearity of the lattice parameter was an indication of gradient alloying of the nanocrystals, whereas the kinetics of the optical properties unravelled the effect of intrinsic optical bowing. Displacement of bond length and anion mismatch influenced the optical properties of the QDs with respect to the variation in the PL QY. Alloyed CdZnSeS/ZnSe1.0S1.3 QDs with a spectacular PL QY were exploited as an ultrasensitive fluorescence reporter in a conjugated molecular beacon (MB) assay to detect influenza virus H1N1 RNA. Our detection system was rapid and highly sensitive for detecting extremely low concentrations of H1N1 RNA (down to 2 copies per mL), specific and versatile (detects H1N1 RNA in human serum). For proof of concept, the alloyed CdZnSeS/ZnSe1.0S1.3 QD-MB bioprobe exhibited a superior 12-fold sensitivity over an alloyed CdZnSeS-MB probe, while a conventional CdSe/ZnS-MB probe could not detect extremely low concentrations of influenza virus H1N1 RNA.

An 80μV rms -temporal-noise 82dB-dynamic-range CMOS Image Sensor with a 13-to-19b variable-resolution column-parallel folding-integration/cyclic ADC

Low-noise CMOS image sensors (CIS) employing column-parallel amplifiers that significantly reduce temporal noise, as well as electron-multiplication CCD (EM-CCD) image sensors are becoming popular for very-low-light-level imaging. These low-noise imagers with high-gain amplification in either the charge or voltage domains sacrifice the intra-scene dynamic range. Scientific applications of solid-state imagers strongly require very low temporal noise and wide intra-scene dynamic range as well as very high gray-scale resolution. A column-parallel analog-to-digital converter (ADC) and column-level signal processing in CISs are key techniques to meet these requirements. Single-slope [1,2], successive-approximation [3] and cyclic ADCs [4] are widely used for the column-parallel ADC in CMOS imagers. However, these ADCs require additional gain enhancements to achieve very low temporal noise. A recently reported [5] delta-sigma (ΔΣ) ADC has an attractive feature that low temporal noise and high resolution can be simultaneously attained by an oversampling technique. However, for very high resolution, a high number of samplings per pixel output, e.g., more than 360 samplings for 16b, is required.

A 10 ps Time-Resolution CMOS Image Sensor With Two-Tap True-CDS Lock-In Pixels for Fluorescence Lifetime Imaging

A CMOS lock-in pixel image sensor with embedded storage diodes and lateral electric field modulation (LEFM) of photo-generated charge is developed for fluorescence lifetime imaging. The time-resolved CMOS image sensor (CIS) with twotap lock-in pixels achieves a very high time resolution of 10 ps when images are averaged over 30 frames, a very short intrinsic response time of 180 ps at 374 nm, and a low temporal random noise of 1.75e-rms with true correlated double sampling (CDS) operation. In addition, by using the LEFM and optimized process, a very high extinction ratio of approximately 94% at 472 nm laser diode is achieved. The usefulness of the proposed CIS is demonstrated for fluorescence lifetime imaging with the simulation and measurement results.

A low noise wide dynamic range CMOS image sensor with low-noise transistors and 17b column-parallel ADC

An extremely low temporal noise and wide dynamic range CMOS image sensor is developed using low-noise transistors and high gray-scale resolution (17b) folding-integration/cyclic ADC. Two types of pixel are designed. One is a high conversion gain (HCG) pixel with removing the coupling capacitance between the transfer gate and the floating diffusion, and the other is a pixel for wide dynamic range (WDR) CMOS imager with the native transistor as a source follower amplifier. The CMOS image sensor which is in combination with the proposed pixels and the high performance column ADC has achieved a low pixel temporal noise of 1.1e-rms and a wide dynamic range of 87.5dB with the video rate operation (30Hz). In addition, the WDR pixel has a very small occurrence of the RTS noise because of the effect of the native transistor in the pixel. The implemented HCG CMOS imager and WDR CMOS imager using 0.18μm technology have the pixel conversion gain of 73.2-μV/e- and 22.8-μV/e-, respectively.

An ultrasensitive SiO2-encapsulated alloyed CdZnSeS quantum dot-molecular beacon nanobiosensor for norovirus.

Ultrasensitive, rapid and selective diagnostic probes are urgently needed to overcome the limitations of traditional probes for norovirus (NV). Here, we report the detection of NV genogroup II via nucleic acid hybridization technology using a quantum dot (QD)-conjugated molecular beacon (MB) probe. To boost the sensitivity of the MB assay system, an ultrasensitive QD fluorophore with unique optical properties was synthesized, characterized and exploited as a fluorescence signal generator. Alloyed thioglycolic (TGA)-capped CdZnSeS QDs with a high photoluminescence (PL) quantum yield (QY) value of 92% were synthesized, and a modified silanization method was employed to encapsulate the thiol-capped QDs in a silica layer. The resulting highly luminescent alloyed SiO2-coated CdZnSeS QDs had a remarkable PL QY value of 98%. Transmission electron microscopy and dynamic light scattering confirmed the monodispersity of the alloyed nanocrystals, and zeta potential analysis confirmed their colloidal stability. Powder X-ray diffraction and PL lifetime measurements confirmed the surface modification of the QDs. The alloyed TGA-capped and SiO2-coated CdZnSeS QD-conjugated MB bioprobes detected extremely low concentrations of NV RNA. Ultrasensitive detection of low concentrations of NV RNA with a limit of detection (LOD) of 8.2copies/mL in human serum and a LOD of 9.3 copies/mL in buffer was achieved using the SiO2-coated CdZnSeS QD-MB probes, an increase in sensitivity of 3-fold compared with the detection limit for NV RNA using TGA-capped CdZnSeS QD-MBs. The additional merits of our detection system are rapidity, specificity and improved sensitivity over conventional molecular test probes.

A Low Dark Leakage Current High-Sensitivity CMOS Image Sensor With STI-Less Shared Pixel Design

A CMOS image sensor with a low dark current and high sensitivity is developed with shallow trench isolation (STI) less shared pixel. By sharing in-pixel transistors, such as the reset transistor, select transistor, and source follower amplifier, each pixel achieves a high fill factor of 43% and a high sensitivity of 144.6 ke-/lx · s. In addition, compared with a conventional image sensor which has the STI structure in the pixel for isolation, the developed image sensor achieves a relatively low dark current of 104.5 e-/s/pixel (median), corresponding to a current density Jdark of approximately 30 pA/cm2 at 60 °C. This is a low value and the consequence of not using STI as pixel isolation. Both types of pixels, namely the conventional and the proposed active pixel sensor have the same pixel size of 7.5 × 7.5 μm2 and are fabricated by the same process. The developed imager with STI-less shared pixel obtains sufficiently good responses at 400 to 900 nm, and, particularly, a peak QE of 68% at 600 nm. This is suitable for scientific applications.