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Ming-Che Ho

TSMC

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Publication

Featured researches published by Ming-Che Ho.

Archive | 2010

Mechanisms for forming copper pillar bumps

Ming-Da Cheng; Wen-Hsiung Lu; Chih-Wei Lin; Ching-Wen Chen; Yi-Wen Wu; Chia-Tung Chang; Ming-Che Ho; Chung-Shi Liu

Archive | 2011

POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Yi-Wen Wu; Zheng-Yi Lim; Ming-Che Ho; Chung-Shi Liu

Archive | 2010

CONDUCTIVE PILLAR FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE

Wen-Hsiung Lu; Ming-Da Cheng; Chih-Wei Lin; Ming-Che Ho; Chung-Shi Liu

Archive | 2010

Method of fabricating bump structure

Chun-Lei Hsu; Ming-Che Ho; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Method of Forming Post Passivation Interconnects

Meng-Wei Chou; Hung-Jui Kuo; Ming-Che Ho; Chung-Shi Liu

Archive | 2010

PROTECTION LAYER FOR PREVENTING UBM LAYER FROM CHEMICAL ATTACK AND OXIDATION

Chung-Shi Liu; Chien Ling Hwang; Ming-Che Ho

Archive | 2010

Preventing UBM oxidation in bump formation processes

Chung-Shi Liu; Cheng-Chung Lin; Ming-Che Ho; Kuo Cheng Lin; Meng-Wei Chou

Archive | 2010

Doping minor elements into metal bumps

Ming-Da Cheng; Ming-Che Ho; Chung-Shi Liu; Chien Ling Hwang; Cheng-Chung Lin; Hui-Jung Tsai; Zheng-Yi Lim

Archive | 2014

Package on package device and method of packaging semiconductor die

Chun-Lei Hsu; Chung-Shi Liu; De-Yuan Lu; Ming-Che Ho; Yu-Feng Chen

Archive | 2014

Adjusting sizes of connectors of package components

Chih-Wei Lai; Ming-Che Ho; Tzong-Hann Yang; Chien Rhone Wang; Chia-Tung Chang; Hung-Jui Kuo; Chung-Shi Liu

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Collaboration

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Chung-Shi Liu

TSMC

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Ming-Da Cheng

TSMC

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Yi-Wen Wu

TSMC

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Zheng-Yi Lim

TSMC

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Chih-Wei Lin

TSMC

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Chien Ling Hwang

TSMC

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Chun-Lei Hsu

TSMC

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Hung-Jui Kuo

TSMC

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Cheng-Chung Lin

TSMC

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Chia-Tung Chang

TSMC

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