N. Ramungul
Rensselaer Polytechnic Institute
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by N. Ramungul.
Solid-state Electronics | 2000
T.P. Chow; V. Khemka; J. Fedison; N. Ramungul; K. Matocha; Yi Tang; Ronald J. Gutmann
Abstract The present status of the silicon carbide and gallium nitride bipolar power semiconductor devices is reviewed. Several unipolar and bipolar figures of merit have been examined to demonstrate the potential performance gain to be obtained from silicon carbide and gallium nitride based power devices. Several conventional as well as novel device structures have been examined, some of which have already been demonstrated and others are in their early stages of development. Conventional silicon theory has often been found to be inadequate to explain the characteristics of silicon carbide. Appropriate modifications have been applied to investigate more complicated characteristics of silicon carbide devices.
international symposium on power semiconductor devices and ic s | 1998
R. Patel; V. Khemka; N. Ramungul; T.P. Chow; M. Ghezzo; J.W. Kretchmer
In this paper, we report the fabrication and characterization of phosphorus-implanted 4H-SiC n/sup +//p junction rectifiers. Sheet resistance measurements of the implanted layers indicated values as low as 160 /spl Omega///spl square/. The forward characteristics of these diodes obey a generalized Shockley-Noyce-Sah (SNS) multiple-trap recombination model with 4 shallow levels and 1 deep level. Close-to-ideal avalanche breakdown voltage with a positive temperature coefficient is observed. The high-level injection lifetime has been extracted to characterize the switching behaviour of these diodes.
international symposium on power semiconductor devices and ic s | 1999
V. Khemka; R. Patel; N. Ramungul; T.P. Chow; Ronald J. Gutmann
Implanted, high-voltage, planar junction rectifiers in 4H-SiC are fabricated using a deep boron implanted junction along with a shallow heavily doped layer created by co-implantation of aluminum and carbon. The fabricated junctions can block up to about 1100 V with low forward drop and low leakage current. The static and dynamic characteristics of these rectifiers have been investigated at both room temperature and high temperature.
international symposium on power semiconductor devices and ic s | 1998
N. Ramungul; T.P. Chow
This paper presents an experimental demonstration of a current-controlled negative resistance (CCNR) in the forward characteristics of 6H-SiC P-i-N rectifiers. These forward characteristics indicate that the poor electrical performance of SiC diodes arises because conductivity modulation is not yet established. The cause of this behaviour appears to be high defect densities and low minority carrier lifetime in the lightly doped drift region. N/sup +/P junctions exhibit excellent forward characteristics with forward drop of 2.8 V at 100 A/cm/sup 2/ and 3.9 V at 1000 A/cm/sup 2/ without entering the CCNR mode when traps have been filled prior to the measurement.
Journal of Electronic Materials | 1999
V. Khemka; R. Patel; N. Ramungul; T.P. Chow; Mario Ghezzo; James W. Kretchmer
Materials Science Forum | 1998
N. Ramungul; V. Khemka; T. Paul Chow; Mario Ghezzo; James W. Kretchmer
Solid-state Electronics | 1998
N. Ramungul; V. Khemka; R. Tyagi; T.P. Chow; Mario Ghezzo; P.G. Neudeck; James W. Kretchmer; William Andrew Hennessy; Dale M. Brown
Materials Science Forum | 1998
Emil Arnold; N. Ramungul; T. Paul Chow; Mario Ghezzo
Materials Science Forum | 1998
N. Ramungul; Yan Jun Zheng; R. Patel; V. Khemka; T. Paul Chow
Materials Science Forum | 2000
Jeffery B. Fedison; Z. Li; V. Khemka; N. Ramungul; T. Paul Chow; Mario Ghezzo; James W. Kretchmer; Ahmed Elasser