Olivier Nier
STMicroelectronics
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Publication
Featured researches published by Olivier Nier.
Journal of Applied Physics | 2014
Yann-Michel Niquet; Viet-Hung Nguyen; François Triozon; Ivan Duchemin; Olivier Nier; D. Rideau
We discuss carrier mobilities in the quantum Non-Equilibrium Greens Functions (NEGF) framework. We introduce a method for the extraction of the mobility that is free from contact resistance contamination and with minimal needs for ensemble averages. We focus on silicon thin films as an illustration, although the method can be applied to various materials such as semiconductor nanowires or carbon nanostructures. We then introduce a new paradigm for the definition of the partial mobility μM associated with a given elastic scattering mechanism “M,” taking phonons (PH) as a reference (μM−1=μPH+M−1−μPH−1). We argue that this definition makes better sense in a quantum transport framework as it is free from long range interference effects that can appear in purely ballistic calculations. As a matter of fact, these mobilities satisfy Matthiessens rule for three mechanisms [e.g., surface roughness (SR), remote Coulomb scattering (RCS) and phonons] much better than the usual, single mechanism calculations. We als...
european solid-state device research conference | 2014
F. Andrieu; M. Cassé; E. Baylac; P. Perreau; Olivier Nier; D. Rideau; Remy Berthelon; F. Pourchon; A. Pofelski; B. De Salvo; Claire Gallon; Vincent Mazzocchi; David Barge; C. Gaumer; Olivier Gourhant; A. Cros; Vincent Barral; R. Ranica; N. Planes; W. Schwarzenbach; E. Richard; E. Josse; O. Weber; F. Arnaud; M. Vinet; O. Faynot; M. Haond
We fabricated Fully-Depleted (FD) nMOSFETs on strain-SOI substrates (sSOI), exceeding regular FDSOI devices by +20% in nMOS ON-state current (ION) and +18% in SRAM read current. For pMOSFETs on sSOI, the integration of Si0.57Ge0.43 by the Ge-enrichment technique (in so-called sSGOI) is the solution to reach the performance of Si0.78Ge0.22 channels built on SOI (SGOI) in terms of short channel hole mobility and ION. We analyse the layout effects in sSOI/sSGOI transistors, ring oscillators (ROs) and SRAMs for different Ge amounts and strains and report for the first time the carrier mobility in sSOI/sSGOI vs. the active length (Lac). Through a layout optimization, a high uniaxial strain can be created, boosting the carrier mobility in both sSOI/sSGOI by 10/20% and ensuring the scalability of the planar FDSOI architecture for the 10nm node.
IEEE Transactions on Electron Devices | 2014
Viet-Hung Nguyen; Yann-Michel Niquet; François Triozon; Ivan Duchemin; Olivier Nier; D. Rideau
We compute the electron and hole mobilities in ultrathin body and buried oxide, fully depleted silicon on insulator devices with various high-\(\kappa \) metal gate-stacks using nonequilibrium Greens functions (NEGF). We compare our results with experimental data at different back gate biases and temperatures. That way, we are able to deembed the different contributions to the carrier mobility in the films (phonons, front and back interface roughness, and remote Coulomb scattering). We discuss the role played by each mechanism in the front and back interface inversion regimes. We draw attention, in particular, to the clear enhancement of electron- and hole-phonons interactions in the films. These results show that FDSOI devices are a foremost tool to sort out the different scattering mechanisms in Si devices, and that NEGF can provide valuable inputs to technology computer aided design.
international electron devices meeting | 2013
D. Rideau; Y. M. Niquet; Olivier Nier; A. Cros; Jean-Philippe Manceau; Pierpaolo Palestri; David Esseni; V. H. Nguyen; François Triozon; Jean Charles C Barbé; I. Duchemin; D. Garetto; Lee Smith; Luca Silvestri; Franck Nallet; R. Clerc; O. Weber; F. Andrieu; E. Josse; C. Tavernier; H. Jaouen
This paper aims to review important theoretical and experimental aspects of both electrostatics and channel mobility in High-K Metal Gate UTBB-FDSOI MOSFETs. A simulation chain, including advanced quantum solvers, and semi-empirical Technology Computer Assisted Design (TCAD) tools is presented.
joint international eurosoi workshop and international conference on ultimate integration on silicon | 2015
F. G. Pereira; D. Rideau; Olivier Nier; C. Tavernier; François Triozon; D. Garetto; Gabriel Mugny; B. Sklenard; G. Hiblot; Marco G. Pala
We have studied the mobility in the FDSOI devices as a function of silicon thickness, doping, surface orientation and applying different back biases. This study is also done in the near-spacer-region that is partially inverted. Simulations have been obtained with a self-consistent Poisson-Schrödinger which provides a precise energy distribution of carriers and, allied to a Kubo-Greenwood carrier mobility solver, performs a quantum corrected drift diffusion (QCDD) model, capable of capturing non local effects on transport (tunneling) and mobility (influence of geometry).
international conference on ultimate integration on silicon | 2013
Olivier Nier; D. Rideau; R. Clerc; Jean Charles C Barbé; Luca Silvestri; Franck Nallet; C. Tavernier; H. Jaouen
The usefulness for technology computer-aided design (TCAD) tools of the bulk linear piezoresistive theory is limited for two reasons. The first is that the normal effective field breaks piezoresistive tensor symmetries increasing the number of independent coefficients from three to six. The second reason is due to the non-linear behavior of the mobility change at high stress values. In this paper, we investigated the six-order polynomial piezoresistive model recently published by Synopsys (MCmob) [16,17]. We demonstrated that a 3D k-space Monte-Carlo solver cannot be used for MCmob parameters calibration (as initially proposed in [16]) as it does not account for quantum confinement. Instead, using self-consistent k.p Poisson-Schrodinger solvers (Kubo-2Dk Greenwood formalism [14, 15] for mobility), we determined a set of parameters for MCmob in the case of p-type FDSOI MOSFETs with <;100> and <;110>-oriented silicon channels on (100)-oriented wafers.
international conference on simulation of semiconductor processes and devices | 2015
C. Tavernier; F.G. Pereira; Olivier Nier; D. Rideau; F. Monsieur; G. Torrente; M. Haond; H. Jaouen; O. Noblanc; Y.M. Niquet; M-A. Jaud; F. Triozon; M. Cassé; J. Lacord; J-C. Barbe
This paper reviews the main challenges for the TCAD of 14nm Fully-Depleted Silicon-On-Insulator (FDSOI) technology performance assessment. Thanks to a multi-scale approach combining extensive electrical characterization and advanced solvers simulations, ensuring deep physical insight, we provide TCAD simulation framework for device layout optimization, strain engineering and device reliability assessment.
international conference on microelectronic test structures | 2014
Olivier Nier; D. Rideau; A. Cros; F. Monsieur; G. Ghibaudo; R. Clerc; Jean Charles C Barbé; C. Tavernier; H. Jaouen
This paper aims at reviewing experimental and theoretical behaviors of universal mobility in high-k metal gate UTBB-FDSOI devices. Based on split-CV mobility measurements, the parameter η characterizing the effective field, has been extracted for a large range of back voltages and temperatures in devices with various equivalent oxide thicknesses. We demonstrated that a nearly universal trend for the mobility with respect to the effective field can be obtained in the front inversion regime but is difficult to obtain in the back channel inversion regime.
Archive | 2014
Olivier Nier; D. Rideau; Pierre Morin; E. Josse
Journal of Computational Electronics | 2013
Olivier Nier; D. Rideau; Yan Michel Niquet; F. Monsieur; Van Dai Nguyen; François Triozon; A. Cros; R. Clerc; Jean Charles C Barbé; Pierpaolo Palestri; David Esseni; Ivan Duchemin; Leo Smith; Luca Silvestri; Franck Nallet; C. Tavernier; H. Jaouen; L. Selmi