Partha Pratim Pande

Performance evaluation and design trade-offs for network-on-chip interconnect architectures

Multiprocessor system-on-chip (MP-SoC) platforms are emerging as an important trend for SoC design. Power and wire design constraints are forcing the adoption of new design methodologies for system-on-chip (SoC), namely, those that incorporate modularity and explicit parallelism. To enable these MP-SoC platforms, researchers have recently pursued scaleable communication-centric interconnect fabrics, such as networks-on-chip (NoC), which possess many features that are particularly attractive for these. These communication-centric interconnect fabrics are characterized by different trade-offs with regard to latency, throughput, energy dissipation, and silicon area requirements. In this paper, we develop a consistent and meaningful evaluation methodology to compare the performance and characteristics of a variety of NoC architectures. We also explore design trade-offs that characterize the NoC approach and obtain comparative results for a number of common NoC topologies. To the best of our knowledge, this is the first effort in characterizing different NoC architectures with respect to their performance and design trade-offs. To further illustrate our evaluation methodology, we map a typical multiprocessing platform to different NoC interconnect architectures and show how the system performance is affected by these design trade-offs.

Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation

The Network-on-Chip (NoC) paradigm has emerged as a revolutionary methodology for integrating a very high number of intellectual property (IP) blocks in a single die. The achievable performance benefit arising out of adopting NoCs is constrained by the performance limitation imposed by the metal wire, which is the physical realization of communication channels. With technology scaling, only depending on the material innovation will extend the lifetime of conventional interconnect systems a few technology generations. According to International Technology Roadmap for Semiconductors (ITRS) for the longer term, new interconnect paradigms are in need. The conventional two dimensional (2D) integrated circuit (IC) has limited floor-planning choices, and consequently it limits the performance enhancements arising out of NoC architectures. Three dimensional (3D) ICs are capable of achieving better performance, functionality, and packaging density compared to more traditional planar ICs. On the other hand, NoC is an enabling solution for integrating large numbers of embedded cores in a single die. 3D NoC architectures combine the benefits of these two new domains to offer an unprecedented performance gain. In this paper we evaluate the performance of 3D NoC architectures and demonstrate their superior functionality in terms of throughput, latency, energy dissipation and wiring area overhead compared to traditional 2D implementations.

Scalable Hybrid Wireless Network-on-Chip Architectures for Multicore Systems

Multicore platforms are emerging trends in the design of System-on-Chips (SoCs). Interconnect fabrics for these multicore SoCs play a crucial role in achieving the target performance. The Network-on-Chip (NoC) paradigm has been proposed as a promising solution for designing the interconnect fabric of multicore SoCs. But the performance requirements of NoC infrastructures in future technology nodes cannot be met by relying only on material innovation with traditional scaling. The continuing demand for low-power and high-speed interconnects with technology scaling necessitates looking beyond the conventional planar metal/dielectric-based interconnect infrastructures. Among different possible alternatives, the on-chip wireless communication network is envisioned as a revolutionary methodology, capable of bringing significant performance gains for multicore SoCs. Wireless NoCs (WiNoCs) can be designed by using miniaturized on-chip antennas as an enabling technology. In this paper, we present design methodologies and technology requirements for scalable WiNoC architectures and evaluate their performance. It is demonstrated that WiNoCs outperform their wired counterparts in terms of network throughput and latency, and that energy dissipation improves by orders of magnitude. The performance of the proposed WiNoC is evaluated in presence of various traffic patterns and also compared with other emerging alternative NoCs.

Design of a switch for network on chip applications

System on Chip (SoC) design in the forthcoming billion transistor era will involve the integration of numerous heterogeneous semiconductor intellectual property (IP) blocks. Some of the main problems in the ultra deep sub micron technologies characterized by gate lengths in the range of 50-100 nm arise from non-scalable global wire delays, failure to achieve global synchronization, errors due to signal integrity issues, and difficulties associated with non-scalable bus-based functional interconnect. These problems are addressed in this paper by introducing a new design methodology. A switch-based network-centric architecture to interconnect IP blocks is proposed. We introduce a butterfly fat tree architecture as an overall interconnect template. In this new interconnect architecture, switches are used to transfer data between IP blocks. To reduce overall latency and hardware overhead, wormhole routing is adopted. The proposed switch architecture supports this routing method. Initial implementation of the switch reveals that the total switch area is expected to amount to less than 2% of a large SoC.

System-on-Chip: Reuse and Integration

Over the past ten years, as integrated circuits became increasingly more complex and expensive, the industry began to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC) design. In this paper, we focus on the reuse and integration issues encountered in this paradigm shift. The reusable components, called intellectual property (IP) blocks or cores, are typically synthesizable register-transfer level (RTL) designs (often called soft cores) or layout level designs (often called hard cores). The concept of reuse can be carried out at the block, platform, or chip levels, and involves making the IP sufficiently general, configurable, or programmable, for use in a wide range of applications. The IP integration issues include connecting the computational units to the communication medium, which is moving from ad hoc bus-based approaches toward structured network-on-chip (NoC) architectures. Design-for-test methodologies are also described, along with verification issues that must be addressed when integrating reusable components.

Design, synthesis, and test of networks on chips

For networks on chips to succeed as the next generation of on-chip interconnect, researchers must solve the major problems involved in designing, implementing, verifying, and testing them. This article surveys the latest NoC architectures, methods, and tools and shows what must happen to make NoCs part of a viable future.

Wireless NoC as Interconnection Backbone for Multicore Chips: Promises and Challenges

Current commercial systems-on-chips (SoCs) designs integrate an increasingly large number of predesigned cores and their number is predicted to increase significantly in the near future. For example, molecular-scale computing promises single or even multiple order-of-magnitude improvements in device densities. The network-on-chip (NoC) is an enabling technology for integration of large numbers of embedded cores on a single die. The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency and significant power consumption arising out of long multi-hop links used in data exchange. The latency, power consumption and interconnect routing problems of conventional NoCs can be addressed by replacing or augmenting multi-hop wired paths with high-bandwidth single-hop long-range wireless links. This opens up new opportunities for detailed investigations into the design of wireless NoCs (WiNoCs) with on-chip antennas, suitable transceivers and routers. Moreover, as it is an emerging technology, the on-chip wireless links also need to overcome significant challenges pertaining to reliable integration. In this paper, we present various challenges and emerging solutions regarding the design of an efficient and reliable WiNoC architecture.

Networks-on-chip in emerging interconnect paradigms: Advantages and challenges

Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simplify and optimize SoC design. However, it is expected that improving traditional communication technologies and interconnect organizationswill not be sufficient to satisfy the demand for energy-efficient and high-performance interconnect fabrics, which continues to grow with each new process generation. Multiple options have been envisioned as compelling alternatives to the existing planar metal/dielectric communication structures. In this paper we outline the opportunities and challenges associated with three emerging interconnect paradigms: three-dimensional (3-D) integration, nanophotonic communication, and wireless interconnects.

Design of an Energy-Efficient CMOS-Compatible NoC Architecture with Millimeter-Wave Wireless Interconnects

The Network-on-chip (NoC) is an enabling technology to integrate large numbers of embedded cores on a single die. The existing methods of implementing a NoC with planar metal interconnects are deficient due to high latency and significant power consumption arising out of multihop links used in data exchange. To address these problems, we propose design of a hierarchical small-world wireless NoC architecture where the multihop wire interconnects are replaced with high-bandwidth and single-hop long-range wireless shortcuts operating in the millimeter (mm)-wave frequency range. The proposed mm-wave wireless NoC (mWNoC) outperforms the corresponding conventional wireline counterpart in terms of achievable bandwidth and is significantly more energy efficient. The performance improvement is achieved through efficient data routing and optimum placement of wireless hubs. Multiple wireless shortcuts operating simultaneously further enhance the performance, and provide an energy-efficient solution for design of communication infrastructures for multicore chips.

BIST for network-on-chip interconnect infrastructures

In this paper, we present a novel built-in self-test methodology for testing the inter-switch links of network-on-chip (NoC) based chips. This methodology uses a high-level fault model that accounts for crosstalk effects due to inter-wire coupling. The novelty of our approach lies in the progressive reuse of the NoC infrastructure to transport test data to its own components under test in a bootstrap manner, and in extensively exploiting the inherent parallelism of the data transport mechanism to reduce the test time and implicitly the test cost