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Dive into the research topics where Paul M. Feeney is active.

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Featured researches published by Paul M. Feeney.


Meeting Abstracts | 2010

CMP Solutions for the Integration of High-K Metal Gate Technologies

Jeffrey Dysard; Vlasta Brusic; Paul M. Feeney; Steven Grumbine; Kevin Moeggenborg; Glenn Whitener; William Ward; Gregory Burns; Kyose Choi

In order to enable high-k metal gate technology, new CMP steps and slurries are needed to meet the stringent planarity and defect requirements for device performance. This paper will describe several of these slurry technologies in detail, including poly-open-polish, Aluminum CMP, and improvements required in Tungsten polishing. The keys to these technologies are outlined and polishing performance given in detail. The critical mechanisms involved in the material polishing for each of these steps are also introduced. All of these new technologies are needed in order to build a successful high-k metal gate device for advanced node integration via a replacement gate build strategy.


Archive | 2002

Slurry for mechanical polishing (CMP) of metals and use thereof

Donald F. Canaperi; William J. Cote; Paul M. Feeney; Mahadevaiyer Krishnan; Joyce C. Liu; Michael F. Lofaro; Philip Murphy; Eric J. White


Archive | 2005

Controlled electrochemical polishing method

Paul M. Feeney; Vlasta Brusic


Archive | 2000

Method and structure of column interconnect

John J. Ellis-Monaghan; Paul M. Feeney; Robert M. Geffken; Howard S. Landis; Rosemary A. Previti-Kelly; Bette L. Bergman Reuter; Matthew J. Rutten; Anthony K. Stamper; Sally J. Yankee


Archive | 2001

Chemical mechanical polishing slurry and method for polishing metal/oxide layers

Paul M. Feeney; Timothy C. Krywanczyk; Lawrence Daniel David; Matthew T. Tiersch; Eric J. White


Archive | 2000

Method of reducing planarization defects

Susan G. Bombardier; Paul M. Feeney; Robert M. Geffken; David V. Horak; Matthew J. Rutten


Archive | 1999

Chemical-mechanical planarization of metallurgy

Vlasta Brusic; Daniel C. Edelstein; Paul M. Feeney; William L. Guthrie; Mark A. Jaso; Frank B. Kaufman; Naftali E. Lustig; Peter Roper; Kenneth P. Rodbell; David B. Thompson


Archive | 2001

Metallurgy for semiconductor devices

Jonathan D. Chapple-Sokol; Paul M. Feeney; Robert M. Geffken; David V. Horak; Mark P. Murray; Anthony K. Stamper


Archive | 2006

Compositions for polishing aluminum/copper and titanium in damascene structures

Vlasta Brusic; Renjie Zhou; Paul M. Feeney; Christopher Thompson


Archive | 2001

Mfg. structure for column connection with integrated circuit chip with numerous interconnected layers of coupling metallising

John J. Ellis-Monaghan; Paul M. Feeney; Robert M. Geffken; Howard S. Landis; Rosemary A. Previti-Kelly; Bette L. Bergman-Reuter; Matthew J. Rutten; Anthony K. Stamper; Sally J. Yankee

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