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Dive into the research topics where Paul M. Harvey is active.

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Featured researches published by Paul M. Harvey.


electrical performance of electronic packaging | 2006

A method to measure impedance of chip/package/board power supply system using pseudo-impulse current

Yaping Zhou; Sang Hoo Dhong; Brian Flachs; Paul M. Harvey; Brad W. Michael

A method to measure the impedance Z(f) of a chip/package/board power supply system using pseudo-impulse current is described. This method can be easily applied to the digital systems with synchronous clocking systems. A PowerPC based microprocessor power supply system is used as an example to show the effectiveness of the method


electrical performance of electronic packaging | 2007

Distributed On-chip Power Supply Noise Characterization of the Cell Broadband Engine

Yaping Zhou; Paul M. Harvey; Brian Flachs; John Samuel Liberty; Gilles Gervais; Rohan Mandrekar; Howard H. Chen; Tetsuji Tamura

Noise characterization of the 65 nm multicore Cell Broadband Enginetrade (Cell/B.E.)* processor was performed using highly configurable workloads and selective stimulation of identical cores to study noise distribution throughout the chip. On-chip power supply noise propagation velocity and attenuation were found to be influenced by chip/package resonance in the power distribution system. Hypothesis for this phenomenon is proposed.


electrical performance of electronic packaging | 2006

Power supply noise simulation considering dynamic effect of on-chip current

Yaping Zhou; Sang Hoo Dhong; Yoichi Nishino; Paul M. Harvey; Rohan Mandrekar; Gilles Gervais; Nikki Criscolo

This paper describes a technique to analyze the dependence of on-chip switching current on power supply voltage and temperature, and how to implement that in power supply noise simulations. It is shown that this on-chip dynamic effect can introduce significant damping to the otherwise passive chip/package/board power supply network


electrical performance of electronic packaging | 2008

Simulation of worst case switching noise on a DDR2 interface

Rohan Mandrekar; Paul M. Harvey; Jim Kuruts; Daniel M. Dreps; Tolga Ozguner; Yaping Zhou

This paper describes a new technique to simulate worst case simultaneous switching noise on a DDR2 interface. The paper focuses on how the impedance response of the power distribution network can be used in determining an excitation pattern that results in the worst case switching noise on the interface.


Archive | 2003

Flex-based IC package construction employing a balanced lamination

Paul M. Harvey


Archive | 2007

Ball grid array package construction with raised solder ball pads

Paul M. Harvey


Archive | 2008

Electrically Optimized and Structurally Protected Via Structure for High Speed Signals

Paul M. Harvey; Kazushige Kawasaki; Gen Yamada


Archive | 2007

Method and Apparatus to Reduce Impedance Discontinuity in Packages

Paul M. Harvey; Douglas O. Powell; Wolfgang Sauter; Yaping Zhou


Archive | 2006

Impedane measurement of chip, package, and board power supply system using pseudo impulse response

Makoto Aikawa; Sang Hoo Dhong; Brian Flachs; Paul M. Harvey; Brad W. Michael; Yaping Zhou


Archive | 2005

Systems and methods for reducing simultaneous switching noise in an integrated circuit

Eiichi Hosomi; Paul M. Harvey

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