Pompei L. Orlando

A −189 dBc/Hz FOM T wide tuning range Ka-band VCO using tunable negative capacitance and inductance redistribution

An ultra wideband LC voltage-controlled oscillator (LC-VCO) operating in the Ka-band with equally spaced sub-band coarse tuning characteristics is proposed and characterized. A tunable negative capacitance (TNC) circuit technique is used to cancel the fixed capacitance in the LC-tank to extend the tuning range (TR). A digitally-switched varactor coarse tuning structure with an inductance redistribution technique is utilized to reduce VCO gain (KV) and retain uniform spacing between tuning curves. The proposed VCO structure and a baseline VCO are fabricated in a 130 nm CMOS process. Compared to the reference VCO, the proposed VCO achieves a 34% increase in TR with maximum KV of 450 MHz/V. The measured worst-case phase noise is -100.1 dBc/Hz at 1 MHz offset across the TR from 30.5 GHz to 39.6 GHz. The power dissipation of the VCO core is 11 mW from a 1.2 V supply. The TNC-based VCO achieves a FOMT of -189 dBc/Hz, which is the highest reported at the Ka-band.

Frequency Tuning Range Extension in LC-VCOs Using Negative-Capacitance Circuits

We present an experimentally validated capacitance cancellation structure to increase the tuning range (TR) of LC voltage-controlled oscillators (VCOs) with minimal phase noise or power impact. The cancellation is based on an ultrawideband differential active negative-capacitance (NC) circuit. An NC scheme suitable for bottom-biased VCOs is analyzed and combined with a CMOS VCO to cancel the fixed capacitance in the LC tank. The NC structure is further modified to be tunable, enabling additional expansion of the VCO TR. By manipulating the quality factor (Q) of the NC tuning varactor pair, a prototype VCO achieves a maximum TR of 27% in a 130-nm technology, while dissipating 13 mA from a 0.9-V supply. The TR is the highest reported at Q-band, covering from 34.5 GHz to 45.4 GHz. Compared to the reference VCO without an NC circuit, the TR is increased by 38%. The measured worst case phase noise is -95 dBc/Hz at 1-MHz offset, and the FOMT is -184.9 dBc/Hz.

Design of Wide Tuning-Range mm-Wave VCOs Using Negative Capacitance

Negative capacitance (NC) circuits of single-ended and differential topologies are presented, analyzed and characterized. The novel NC designs extend the bandwidth of conventional NC circuits while maintaining low power consumption. To compare the performance of the designs, a figure of merit (FOM) is proposed. A power and area efficient NC scheme employing a 130 nm CMOS technology is applied to a mm-wave LC Voltage Controlled Oscillator (LC-VCO) for demonstration. The VCO tuning range is extended by employing the NC circuit to cancel the parasitic capacitance of the LC-tank; resulting in a 35% tuning range increase as compared to the reference LC-VCO circuit. The NC-based LC-VCO achieved a 27% tuning range in the Q-Band, which is the highest reported. Measured results compare closely to the theoretical analysis of the LC-VCO operating from 34.5-45.4 GHz.

An indium phosphide X-band class-E power MMIC with 40% bandwidth

A broadband, high efficiency, X-band power amplifier is presented in this paper. The single-stage amplifier is based on indium phosphide (InP) double heterojunction bipolar transistor (DHBT) technology. In order to obtain high efficiency operation, a switch mode, class-E amplifier topology was selected. Special attention has been paid to providing the required fundamental matching conditions, as well as appropriate harmonic terminations, over the frequency band of interest. As a result, the amplifier obtained a bandwidth of 40%, with 45-60% PAE, 19-21.5dBm Pout, and 9-11.5dB large-signal gain at X-band. To the best of our knowledge, this circuit demonstrates the widest bandwidth for a class-E amplifier at X-band.

Design of a frequency agile X-band LNA using BST varactor based voltage tunable impedance matching networks

Current advancements in military and wireless applications create the need for increased functionality with reduced cost and size. In this paper a highly integrated tunable electronics are necessary to meet these new requirements. Barium strontium titanium oxide (BST) is a viable technology for these applications. BST technology offers significant benefits with its high tuning range, high power capabilities and low control voltages. While there is great interest in the development of BST technology, little research has been published regarding integrated matching networks using BST thin film parallel plate capacitors for an X-band low noise amplifier (LNA).

RF filters in SiGe BiCMOS technology and fully depleted silicon-on-insulator CMOS technology

This paper presents two integrated non-reflective bandpass filters. The filters are implemented in a silicon germanium (SiGe) BiCMOS technology and fully depleted silicon on insulator (FDSOI) CMOS technology. The purpose of these circuits is to explore the feasibility of passive filter applications on silicon substrates while maintaining low insertion loss and 50 Ohm impedance matching. The SiGe-based filter achieved 3.3-4.2 dB insertion loss across 3.5-4.5 GHz with input return loss better than -10 dB from 1-10 GHz. The FDSOI filter simulation yielded an insertion loss of 4.5 dB across the design frequency of 3.7-4.3 GHz

Digital beamforming using highly integrated receiver-on-chip modules

This paper describes the demonstration of a four-channel digital beamforming system incorporating highly integrated silicon germanium downconverter modules. The downconverter modules are designed to translate X-band frequencies (9 to 10.5 GHz) down to a common 1.0 GHz IF output. The modules were integrated with an X-band antenna array and high-speed digitizer system to form a rudimentary digital beamforming subsystem. Data was collected in a compact antenna range and compared to simulated antenna patterns. Basic calibration and beamforming methods were applied to showcase the ability to include new, highly integrated components into digital beamforming subsystem demonstrations.

X-Band Receiver Front-End Chip in Silicon Germanium Technology

This paper reports a demonstration of X-band receiver RF front-end components and the integrated chipset implemented in 0.18 mum silicon germanium (SiGe) technology. The system architecture consists of a single down conversion from X-band at the input to S-band at the intermediate frequency (IF) output. The microwave monolithic integrated circuit (MMIC) includes an X-band low noise amplifier, lead-lag splitter, balanced amplifiers, double balanced mixer, absorptive filter, and an IF amplifier. The integrated chip achieved greater than 30 dB of gain and less than 6 dB of noise figure.

A low voltage SiGe BJT integrated RF amplifier with very high third order intercept point

We present a 0.7 to 1.3 GHz RF amplifier with very high third order intercept point (IP3) for use in an integrated receiver. The amplifier is designed in a modern high volume commercial SiGe HBT process and operates with a collector voltage of 1.8 V. An integrated shunt diode linearizer, inductive emitter degeneration, and output impedance matching are all optimized together to achieve an IP3 of +40 dBm with an IP3/Pdc figure of merit ratio of 18.5. This combination of techniques has resulted in unprecedented linearity for a design in a silicon process with a low breakdown voltage

X-band receiver module in fully depleted silicon on insulator technology

This paper reports on the successful demonstration of radio frequency (RF) components in support of an integrated wide band/high dynamic range X-band receiver in 180-nm fully-depleted (FD) SOI CMOS technology. The demonstrated microwave monolithic integrated circuit (MMIC) includes an X-band low noise amplifier (LNA), Marchand balun, balanced amplifiers, double balanced mixer, non-reflective filter, and an IF amplifier. The X-band receiver front end module yielded a gain of 13.5-15 dB, 5.2-5.8 dB noise figure (NF), across the frequency band (3.7-4.3 GHz).