Rabindra N. Das

3D integrated superconducting qubits

As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2,echou2009>u200920u2009μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.Addressing qubits in a large-scale quantum processorSuperconducting qubits are a leading technology for realizing a quantum computer. To date, experiments have demonstrated control of up to ten qubits using interconnects that laterally address the qubits from the edge of a chip. Extending to larger numbers, however, will require utilizing the third dimension to avoid interconnect crowding and enable control and readout of all qubits in a two-dimensional array. Danna Rosenberg and a team led by William D. Oliver at MIT Lincoln Laboratory and MIT campus have developed a 3D design for efficiently addressing large numbers of qubits, comprising a stack of three bonded chips, each of which performs a different function. The team performed a proof-of-principle experiment using two bonded chips, demonstrating off-chip control and read out of a qubit without significantly impacting the quality of the qubit performance. This demonstration is an important step towards the 3D integration required to build larger-scale devices for quantum information processing.

Multispectral pixel performance using a one-dimensional photonic crystal design

A photodetector pixel using a photonic crystal structure incorporating photoconductive layers has been realized. The fabricated device exploits mode discrimination and resonant cavity enhancement to provide simultaneous multispectral detection capability, high quantum efficiency, and dramatically suppressed shot noise. Detectivities as high as 2.6×1010 and 2.0×1010cmHz1∕2W−1 at the two preselected wavelengths, 632 and 728nm, were achieved, respectively.

Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators

Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quality factors and coherence times. Here we demonstrate titanium nitride coplanar waveguide resonators with mean quality factors exceeding two million and controlled trenching reaching 2.2

Multispectral 1-D Photonic Crystal Photodetector

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Interconnect Structures For Assembly Of Semiconductor Structures Including At Least One Integrated Circuit Structure

m into the silicon substrate. Additionally, we measure sets of resonators with a range of sizes and trench depths and compare these results with finite-element simulations to demonstrate quantitative agreement with a model of interface dielectric loss. We then apply this analysis to determine the extent to which trenching can improve resonator performance.

Interconnect structures for assembly of multi-layer semiconductor devices

We demonstrate a novel photoconductor pixel, by using a photonic crystal structure incorporating photoconductive layers, which exploits resonant cavity enhancement to provide us with multispectral capability, high quantum efficiency, and dramatically suppressed shot noise