Ralph M. Wadensweiler

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Featured researches published by Ralph M. Wadensweiler.

Archive | 2003

Conductive polishing article for electrochemical mechanical polishing

Paul D. Butterfield; Liang-Yuh Chen; Yongqi Hu; Antoine P. Manens; Rashid Mavliev; Stan D. Tsai; Feng Q. Liu; Ralph M. Wadensweiler; Lizhong Sun; Siew Neo; Alain Duboust

Archive | 2002

Method and apparatus for substrate polishing

Ralph M. Wadensweiler; Alain Duboust; Liang-Yuh Chen; Manoocher Birang; Ratson Morad; Paul D. Butterfield

Archive | 2006

Pad assembly for electrochemical mechanical processing

Shou-sung Chang; Stan D. Tsai; Donald J. K. Olgado; Liang-Yuh Chen; Alain Duboust; Ralph M. Wadensweiler

Archive | 1997

Electrostatic chuck having a thermal transfer regulator pad

Ralph M. Wadensweiler; Ajay Kumar; Shashank C. Deshmukh; Weinan Jiang; Rolf A. Guenther

Archive | 2004

Method and apparatus for electrochemical mechanical processing

Yan Wang; Siew Neo; Feng Liu; Stan D. Tsai; Yongqi Hu; Alain Duboust; Antoine P. Manens; Ralph M. Wadensweiler; Rashid Mavliev; Liang-Yuh Chen; Donald J. K. Olgado; Paul D. Butterfield; Ming-Kuei Tseng; Shou-sung Chang; Lizhong Sun

Archive | 2004

Composite pad assembly for electrochemical mechanical processing (ECMP)

Yongqi Hu; Stan D. Tsai; Feng Q. Liu; Liang-Yuh Chen; Ralph M. Wadensweiler; Paul D. Butterfield; Donald J. K. Olgado; Martin S. Wohlert; Sen-Hou Ko; Shou-sung Chang

Archive | 2005

Abrasive conductive polishing article for electrochemical mechanical polishing

Paul D. Butterfield; Ralph M. Wadensweiler

Archive | 2005

Pad design for electrochemical mechanical polishing

Rashid Mavliev; Paul D. Butterfield; Ralph M. Wadensweiler

Archive | 2003

Etching of high aspect ratio features in a substrate

Ajay Kumar; Anisul Khan; Alan Ouye; Ralph M. Wadensweiler; Ananda H. Kumar; Michael G. Chafin; Arnold Kholodenko; Dragan Podlesnik

Archive | 2006

Conductive pad with ion exchange membrane for electrochemical mechanical polishing

Liang-yun Chen; Yuchun Wang; Yan Wang; Alain Duboust; Daniel A. Carl; Ralph M. Wadensweiler; Manoocher Birang; Paul D. Butterfield; Rashid Mavliev; Stan D. Tsai; You Wang; Jie Diao; Renhe Jia; Lakshmanan Karuppiah; Robert A. Ewald

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