Paul D. Butterfield | Researchain

Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Paul D. Butterfield is active.

Explore More

Publication

Featured researches published by Paul D. Butterfield.

Archive | 2003

Conductive polishing article for electrochemical mechanical polishing

Paul D. Butterfield; Liang-Yuh Chen; Yongqi Hu; Antoine P. Manens; Rashid Mavliev; Stan D. Tsai; Feng Q. Liu; Ralph M. Wadensweiler; Lizhong Sun; Siew Neo; Alain Duboust

Archive | 2003

Apparatus for electrochemical processing

Antoine P. Manens; Paul D. Butterfield

Archive | 2002

Method and apparatus for substrate polishing

Ralph M. Wadensweiler; Alain Duboust; Liang-Yuh Chen; Manoocher Birang; Ratson Morad; Paul D. Butterfield

Archive | 2000

Chemical mechanical planarization system

Phillip R. Sommer; Paul D. Butterfield; Joshua T. Oen; Ching-Ling Meng

Archive | 2004

Method and apparatus for electrochemical mechanical processing

Yan Wang; Siew Neo; Feng Liu; Stan D. Tsai; Yongqi Hu; Alain Duboust; Antoine P. Manens; Ralph M. Wadensweiler; Rashid Mavliev; Liang-Yuh Chen; Donald J. K. Olgado; Paul D. Butterfield; Ming-Kuei Tseng; Shou-sung Chang; Lizhong Sun

Archive | 2002

Polishing media stabilizer

Phillip R. Sommer; Paul D. Butterfield

Archive | 2004

Composite pad assembly for electrochemical mechanical processing (ECMP)

Yongqi Hu; Stan D. Tsai; Feng Q. Liu; Liang-Yuh Chen; Ralph M. Wadensweiler; Paul D. Butterfield; Donald J. K. Olgado; Martin S. Wohlert; Sen-Hou Ko; Shou-sung Chang

Archive | 2008