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Ramaswamy Ranganathan

LSI Corporation

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Publication

Featured researches published by Ramaswamy Ranganathan.

Archive | 2000

Multiple row wire bonding with ball bonds of outer bond pads bonded on the leads

Qwai H. Low; Ramaswamy Ranganathan; Rey Torcuato

Archive | 2004

Test structure for detecting bonding-induced cracks

Qwai H. Low; Ramaswamy Ranganathan; Anwar Ali; Tauman T. Lau

Archive | 2003

Bonding pad for low k dielectric

Qwai H. Low; Ramaswamy Ranganathan; Edwin M. Fulcher

Archive | 2003

Slotted bonding pad

Ramaswamy Ranganathan; Maurice O. Othieno; Qwai H. Low

Archive | 2001

Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads

Qwai H. Low; T. Bright Ii William; Ramaswamy Ranganathan

Archive | 2005

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Jayanthi Pallinti; Dilip Vijay; Hemanshu D. Bhatt; Sey-Shing Sun; Hong Ying; Chiyi Kao; Peter A. Burke; Ramaswamy Ranganathan; Qwai H. Low

Archive | 2003

Bonding pad isolation

Michael J. Berman; Aftab Ahmad; Qwai H. Low; Chok J. Chia; Ramaswamy Ranganathan

Archive | 2003

Insulated bonding wire for microelectronic packaging

Chok J. Chia; Owai H. Low; Ramaswamy Ranganathan

Archive | 2003

Wire bonding to full array bonding pads on active circuitry

Qwai H. Low; Ramaswamy Ranganathan; Maniam Alagaratnam; Chok J. Chia

Archive | 1999

Semiconductor flip chip ball grid array package

Kishor V. Desai; Sunil A. Patel; Ramaswamy Ranganathan

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Qwai H. Low

LSI Corporation

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Chok J. Chia

LSI Corporation

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Aftab Ahmad

LSI Corporation

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Anwar Ali

LSI Corporation

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Chiyi Kao

LSI Corporation

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Dilip Vijay

LSI Corporation

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Edwin M. Fulcher

LSI Corporation

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Hemanshu D. Bhatt

LSI Corporation

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Hong Ying

LSI Corporation

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Jayanthi Pallinti

LSI Corporation

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