Robert Steinhoff
Texas Instruments
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Publication
Featured researches published by Robert Steinhoff.
international symposium on power semiconductor devices and ic s | 2001
Philip L. Hower; Chin-Yu Tsai; Steven L. Merchant; Taylor R. Efland; Sameer Pendharkar; Robert Steinhoff; Jonathan Brodsky
Safe operating area limits for large Ldmos are shown to be due to a thermal instability mechanism initiated by avalanche generated carriers which turn-on the parasitic bipolar transistor. An analytic model is described and is shown to agree well with experimental data.
electrical overstress/electrostatic discharge symposium | 2004
Tom Meuse; Larry Ting; Joe Schichl; Robert Barrett; David Bennett; Roger A. Cline; Charvaka Duvvury; Mike Hopkins; Hans Kunz; John Leiserson; Robert Steinhoff
A previously undetected trailing pulse from HBM testers was found to create unexpected gate oxide failures on new technologies. This secondary pulse, which is EOS in nature, is caused by the discharge relay and the parasitics of the charge circuit. This paper investigates this critical phenomenon and establishes the tester improvements to safely suppress the trailing pulse effects.
international reliability physics symposium | 2007
Marie Denison; Suhail Murtaza; Robert Steinhoff; Steve Merchant; Sameer Pendharkar; Sergey Bychikhin; D. Pogany
A 25 V ESD NPN transistor is made high current capable by means of distributed emitter ballasting. The proposed segmentation of the emitter contact area along the width offers an efficient way to extend the homogeneous current regime without causing any significant increase of the holding voltage. At high current, a second snap-back is observed in the TLP current-voltage characteristics. Transient interferometric mapping analyses show that this voltage drop is due to current filamentation arising at a time decreasing with increasing current amplitude
international symposium on power semiconductor devices and ic's | 2005
Sameer Pendharkar; Jonathan Brodsky; Phil Hower; Robert Steinhoff
An integrated lateral output device is presented which has a very high degree of ESD robustness. The high ESD robustness is achieved with negligible increase in the overall size of the output device. Such an integrated device is ideally suited for high voltage output pins requiring low on-state resistance (Rdson) with stringent system level IEC requirements.
international symposium on power semiconductor devices and ic s | 2001
Sameer Pendharkar; Phil Hower; Robert Steinhoff; Jonathan Brodsky; Joe Devore; Bill Grose
A novel 2D-simulation method is used to simulate major aspects of the formation of the current filament and to help understand and predict the level of ESD robustness in lateral power devices.
electrical overstress/electrostatic discharge symposium | 2003
Robert Steinhoff; Jin-Biao Huang; Philip L. Hower; Jonathan Brodsky
Archive | 2005
Timothy P. Pauletti; Sameer Pendharkar; Wayne Tien-Feng Chen; Jonathan Brodsky; Robert Steinhoff
Archive | 2003
Jonathan Brodsky; Robert Steinhoff; Sameer Pendharkar
Archive | 2000
Robert Steinhoff; Jonathan Brodsky; Thomas A. Vrotsos
Archive | 2006
Robert Steinhoff