Rui Tze Toh

A 130nm RFSOI technology with switch, LNA, and EDNMOS devices for integrated front-end module SoC applications

The cellular frequency spectrum has become increasingly complex with over 50 frequencies in LTE standards. To reduce costs in the front end module the switch has migrated from a III-V PHEMT base to a silicon solution in RFSOI. While many providers have focused on a 180nm base technology node for the RFSOI there has been an increasing move to more advanced nodes to solution the logic requirements of the cellular standards. In addition there has been a strong interest in migrating to an SOC solution in RFSOI. In this paper a 130nm RFSOI technology is presented with high performance and low noise body tied 1.5V NMOS for LNA devices with a novel method of body contacting, low Ron*Coff NMOS for antenna switch and state of the art EDNMOS with fT of 38GHz and BVdss of 14V BVdss for integrated PA application. Specific results presented include characterization of the switch, LNA, and Power Amplifier devices.

A Novel device for low noise amplification in 130nm high resistivity RFSOI technology platform

CMOS Silicon on Insulator (SOI) is now the technology of choice for RF switches in front end module systems. The emergence of 4G cellular systems with carrier aggregation has made the design of front end modules more complex. To take into account the diversity paths now required in cellular systems the low noise amplifiers (LNAss) are being integrated in the front end module along with the switches. This paper describes novel low noise amplifier devices in high resistivity SOI targeted for integration and use in RF front end modules.