Seung-Duk Baek

Chip stack package and manufacturing method thereof

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Wafer level package and methods of fabricating the same

Wafer-level stack package

Three-dimensional semiconductor module having multi-sided ground block

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Semiconductor packages and methods of manufacturing the same

Semiconductor package including redistribution pattern and method of manufacturing the same

Chipstack package and manufacturing method thereof

SEMICONDUCTOR MEMORY DEVICE HAVING IMPROVED VOLTAGE TRANSMISSION PATH AND DRIVING METHOD THEREOF