Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Sun-Won Kang is active.

Publication


Featured researches published by Sun-Won Kang.


international symposium on radio-frequency integration technology | 2017

A preliminary analysis of domain coupling in package power distribution network

Byoungjin Bae; Seungwon Kim; Youngmin Kim; Seokhyeong Kang; Il Joon Kim; Kwang-Seok Kim; Sun-Won Kang; Ki Jin Han

The coupling of power domains in a typical package power distribution network (PDN) is investigated, mainly focusing on the effect of ground structures and substrate parameters. From the simulated impedance parameter data, the self and the coupling capacitances are calculated. The preliminary study shows that the effect of the bottom ground planes has the most dominant effect on the domain coupling, and the ground plane between adjacent power domains can be effectively used to reduce the domain coupling.


Archive | 2008

Some Recent Materials Applications of In Situ High Resolution Electron Microscopy

Robert Sinclair; Sun-Won Kang; K. H. Kim; Joong Sun Park

Since the realization that high resolution electron microscopy (HREM) imaging could be carried out under non-ambient conditions [1, 2], in situ HREM has broadened significantly and is now a well-accepted technique [3]. Our work has largely focused on heating materials to observe at atomic resolution the reactions which occur at elevated temperatures. The extension to environmental studies is likewise a significant achievement [4–6].


Archive | 2007

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Seung-Duk Baek; Sun-Won Kang


Archive | 2008

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Hyun-Soo Chung; Dong-Hyeon Jang; Nam-Seog Kim; Sun-Won Kang


Archive | 2004

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

Sun-Won Kang


Archive | 2010

Wafer-level stack package

Sun-Won Kang; Seung-Duk Baek


Archive | 2006

Three-dimensional semiconductor module having multi-sided ground block

Sun-Won Kang; Seung-Duk Baek


Archive | 2009

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Kwang-Yong Lee; Sun-Won Kang; Sang-hee Kim


Archive | 2009

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Jong-gi Lee; Sun-Won Kang; Young Lyong Kim; Jong-ho Lee; Chul-Yong Jang; Minill Kim; Eun-Chul Ahn; Kwang Yong Lee; Seung-Duk Baek; Ji-Seok Hong


Archive | 2007

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Jongjoo Lee; Sun-Won Kang

Collaboration


Dive into the Sun-Won Kang's collaboration.

Researchain Logo
Decentralizing Knowledge