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Sheng-Yu Wu

TSMC

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Publication

Featured researches published by Sheng-Yu Wu.

Archive | 2016

Dummy flip chip bumps for reducing stress

Sheng-Yu Wu; Tin-Hao Kuo; Chita Chuang; Chen-Shien Chen

Archive | 2011

Connecting Function Chips To A Package To Form Package-On-Package

Pei-Chun Tsai; Sheng-Yu Wu; Ching-Wen Hsiao; Tin-Hao Kuo; Chen-Shien Chen; Chung-Shi Liu; Chien-Hsiun Lee; Mirng-Ji Lii

Archive | 2012

Conical-shaped or tier-shaped pillar connections

Tin-Hao Kuo; Chen-Shien Chen; Mirng-Ji Lii; Chen-Hua Yu; Sheng-Yu Wu; Yao-Chun Chuang

Archive | 2013

Interconnection structure and method of forming same

Yu-Wei Lin; Sheng-Yu Wu; Yu-Jen Tseng; Tin-Hao Kuo; Chen-Shien Chen

Archive | 2011

Semiconductor Devices and Methods of Manufacturing and Packaging Thereof

Sheng-Yu Wu; Tin-Hao Kuo; Chen-Shien Chen; Ming-Da Cheng

Archive | 2012

Elongated Bumps in Integrated Circuit Devices

Yen-Liang Lin; Chen-Shien Chen; Tin-Hao Kuo; Sheng-Yu Wu; Tsung-Shu Lin; Chang-Chia Huang

Archive | 2014

Methods and apparatus for bump-on-trace chip packaging

Chang-Chia Huang; Chen-Shien Chen; Sheng-Yu Wu; Tin-Hao Kuo; Yen-Liang Lin

Archive | 2011

Package-on-Package Process for Applying Molding Compound

Meng-Tse Chen; Wei-Hung Lin; Sheng-Yu Wu; Chun-Cheng Lin; Kuei-Wei Huang; Yu-Peng Tsai; Chih-Wei Lin; Wen-Hsiung Lu; Hsiu-Jen Lin; Bor-Ping Jang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014

Structure and Method for Bump to Landing Trace Ratio

Chen-Hua Yu; Tin-Hao Kuo; Chen-Shien Chen; Mirng-Ji Lii; Sheng-Yu Wu; Yen-Liang Lin

Archive | 2016

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

Sheng-Yu Wu; Tin-Hao Kuo; Chen-Shien Chen

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Collaboration

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Chen-Shien Chen

TSMC

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Tin-Hao Kuo

TSMC

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Yen-Liang Lin

TSMC

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Chang-Chia Huang

TSMC

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Ming-Da Cheng

TSMC

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Mirng-Ji Lii

TSMC

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Chen-Hua Yu

TSMC

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Tsung-Shu Lin

TSMC

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Pei-Chun Tsai

TSMC

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Chita Chuang

TSMC

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