Sunae Seo

A fast, high-endurance and scalable non-volatile memory device made from asymmetric Ta2O5−x/TaO2−x bilayer structures

Numerous candidates attempting to replace Si-based flash memory have failed for a variety of reasons over the years. Oxide-based resistance memory and the related memristor have succeeded in surpassing the specifications for a number of device requirements. However, a material or device structure that satisfies high-density, switching-speed, endurance, retention and most importantly power-consumption criteria has yet to be announced. In this work we demonstrate a TaO(x)-based asymmetric passive switching device with which we were able to localize resistance switching and satisfy all aforementioned requirements. In particular, the reduction of switching current drastically reduces power consumption and results in extreme cycling endurances of over 10(12). Along with the 10 ns switching times, this allows for possible applications to the working-memory space as well. Furthermore, by combining two such devices each with an intrinsic Schottky barrier we eliminate any need for a discrete transistor or diode in solving issues of stray leakage current paths in high-density crossbar arrays.

Observation of electric-field induced Ni filament channels in polycrystalline NiOx film

For high density of resistive random access memory applications using NiOx films, understanding of the filament formation mechanism that occurred during the application of electric fields is required. We show the structural changes of polycrystalline NiOx (x=1–1.5) film in the set (low resistance), reset (high resistance), and switching failed (irreversible low resistance) states investigated by simultaneous high-resolution transmission electron microscopy and electron energy-loss spectroscopy. We have found that the irreversible low resistance state facilitates further increases of Ni filament channels and Ni filament density that resulted from the grain structure changes in the NiOx film.

Tilting of the spin orientation induced by Rashba effect in ferromagnetic metal layer

We devised a method to measure the virtual magnetic field induced by Rashba effect in ferromagnetic metal layer. Transverse Rashba magnetic field makes the magnetization direction tilted out of the easy axis, which could be detected by the change in anomalous hall resistances. Through a specified measurement of the second harmonics of the hall resistance, the Rashba field could be obtained with high sensitivity even at low current regime. The results are compared with the prior reports based on the measurement of the transverse field required for the nucleation of reversed domain.

Resistance switching of the nonstoichiometric zirconium oxide for nonvolatile memory applications

The resistance switching behavior and switching mechanism of nonstoichiometric zirconium oxide thin films were investigated for nonvolatile memory application. The Pt/ZrO/sub x//p/sup +/-Si sandwich structure fabricated by reactive sputtering shows two stable resistance states. By applying proper bias, resistance switching from one to another state can be obtained. The composition in ZrO/sub x/ thin films were confirmed from X-ray photoelectron spectroscope (XPS) analysis, which showed three layers such as top stoichiometric ZrO/sub 2/ layer with high resistance, transition region with medium resistance, and conducting ZrO/sub x/ bulk layer. The resistance switching can be explained by electron trapping and detrapping of excess Zr/sup +/ ions in transition layer which control the distribution of electric field inside the oxide, and, hence the current flow.

Robust bi-stable memory operation in single-layer graphene ferroelectric memory

With the motivation of realizing an all graphene-based circuit for low power, we present a reliable nonvolatile graphene memory device, single-layer graphene (SLG) ferroelectric field-effect transistor (FFET). We demonstrate that exfoliated single-layer graphene can be optically visible on a ferroelectric lead-zirconate-titanate (PZT) substrate and observe a large memory window that is nearly equivalent to the hysteresis of the PZT at low operating voltages in a graphene FFET. In comparison to exfoliated graphene, FFETs fabricated with chemical vapor deposited (CVD) graphene exhibit enhanced stability through a bi-stable current state operation with long retention time. In addition, we suggest that the trapping/de-trapping of charge carriers in the interface states is responsible for the anti-hysteresis behavior in graphene FFET on PZT. V C 2011 American Institute of Physics. [doi:10.1063/1.3619816] Graphene is considered to be an exceptional material with high potential for future electronics, owing to its excellent electronic properties; 1 linear electron energy dispersion, and high room temperature mobility. If feasible, an all graphene-based circuit, including logic, analog, and memory devices, would be of great interest to further extend the performance of current Si-based electronics. Among various device applications, graphene based memory structures are still in their infancy in comparison to its logic and analog applications. To date, graphene memory has been demonstrated through chemical modification, 2 filament-type memristor, 3 nanomechanical switch, 4 and graphene FFETs. 5‐7 In graphene FFETs, however, the ambipolar conduction leads to undesirable on/off states for memory applications. Moreover, the absence of an electronic bandgap and controlled doping makes it difficult to resolve such issues. Therefore, a systematic study of graphene FFET is beneficial to realize graphene-based memory structures. In this Letter, we investigate graphene/PZT FFET structures using exfoliated- and CVD-SLG and their mechanism of operation. We show that exfoliated SLG can be optically identified on a PZT substrate and exhibit a hysteresis of the Vshaped conductance with a large memory window at low operating gate voltages. We compare exfoliated- with CVDSLG FFETs and show that devices made of CVD-SLG exhibit a robust bi-stable current state with a long retention time. In order to construct the SLG FFET, we first engineered a ferroelectric substrate to identify SLG. Previously, we have demonstrated that SLG is invisible under the optical micro

Resistance-switching Characteristics of polycrystalline Nb/sub 2/O/sub 5/ for nonvolatile memory application

The resistance switching characteristics of polycrystalline Nb/sub 2/O/sub 5/ film prepared by pulsed-laser deposition (PLD) were investigated for nonvolatile memory application. Reversible resistance-switching behavior from a high resistance state to a lower state was observed by voltage stress with current compliance. The reproducible resistance-switching cycles were observed and the resistance ratio was as high as 50-100 times. The resistance switching was observed under voltage pulse as short as 10 ns. The estimated retention lifetime at 85/spl deg/C was sufficiently longer than ten years. Considering its excellent electrical and reliability characteristics, Nb/sub 2/O/sub 5/ shows strong promise for future nonvolatile memory applications.

Fast transient charging at the graphene/SiO2 interface causing hysteretic device characteristics

Device instabilities of graphene metal-oxide-semiconductor field effect transistors such as hysteresis and Dirac point shifts have been attributed to charge trapping in the underlying substrate, especially in SiO2. In this letter, trapping time constants around 87 μs and 1.76 ms were identified using a short pulse current-voltage method. The values of two trapping time constants with reversible trapping behavior indicate that the hysteretic behaviors of graphene field effect transistors are due to neither charge trapping in the bulk SiO2 or tunneling into other interfacial materials. Also, it is concluded that the dc measurement method significantly underestimated the performance of graphene devices.

Interdimensional universality of dynamic interfaces

Despite the complexity and diversity of nature, there exists universality in the form of critical scaling laws among various dissimilar systems and processes such as stock markets, earthquakes, crackling noise, lung inflation and vortices in superconductors. This universality is mainly independent of the microscopic details, depending only on the symmetry and dimension of the system. Exploring how universality is affected by the system dimensions is an important unresolved problem. Here we demonstrate experimentally that universality persists even at a dimensionality crossover in ferromagnetic nanowires. As the wire width decreases, the magnetic domain wall dynamics changes from elastic creep in two dimensions to a particle-like stochastic behaviour in one dimension. Applying finite-size scaling, we find that all our experimental data in one and two dimensions (including the crossover regime) collapse onto a single curve, signalling universality at the criticality transition. The crossover to the one-dimensional regime occurs at a few hundred nanometres, corresponding to the integration scale for modern nanodevices.

Role of structural defects in the unipolar resistive switching characteristics of Pt∕NiO∕Pt structures

We investigated the resistive switching characteristics of two types of Pt∕NiO∕Pt structures with epitaxial and polycrystalline NiO layers. Both of these Pt∕NiO∕Pt structures exhibited unipolar resistive switching. Pt/epitaxial-NiO∕Pt showed unstable switching or no resistance state change after several repeated runs. Pt/polycrystalline-NiO∕Pt showed very reproducible switching. The experimental data indicated that microstructural defects (e.g., grain boundaries) played crucial roles in the reliability of the unipolar resistive switching behavior. This was further supported by first-principles calculations.

Decrease in switching voltage fluctuation of Pt∕NiOx∕Pt structure by process control

Resistance change random access memory devices using NiOx films with resistance switching properties have immense potential for high-density nonvolatile memory exceeding currently used flash memory. The only critical failure of a NiOx film is to write wrong information due to large fluctuations of switching voltages during successive resistance switching operations. The authors show that failure-free NiOx film can be grown directly on Pt electrode just by process control. Intensive analyses show that the superior resistance switching behaviors of their simple Pt∕NiOx∕Pt structure may result from a very thin Ni–Pt layer self-formed at the bottom interface during deposition of NiOx.