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Sung-min Sim

Samsung

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Publication

Featured researches published by Sung-min Sim.

Archive | 2005

Method for manufacturing wafer level chip stack package

Soon-bum Kim; Ung-Kwang Kim; Kang-Wook Lee; Se-young Jeong; Young-hee Song; Sung-min Sim

Archive | 2005

Electrode structure of a semiconductor device and method of manufacturing the same

Hyun-Soo Chung; Sung-min Sim; Myeong-Soon Park; Dong-Hyeon Jang; Young-hee Song

Archive | 2005

Fabrication method of wafer level chip scale packages

Soon-bum Kim; Ung-Kwang Kim; Keum-Hee Ma; Young-hee Song; Sung-min Sim; Se-Yong Oh; Kang-Wook Lee; Se-young Jeong

Archive | 2007

Wafer level chip scale package having a gap and method for manufacturing the same

Myeong-Soon Park; Hyun-Soo Chung; In-Young Lee; Jae-Sik Chung; Sung-min Sim; Dong-Hyeon Jang; Young-hee Song; Seung-Kwan Ryu

Archive | 2005

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

In-Young Lee; Sung-min Sim; Dong-Hyeon Jang; Hyun-Soo Chung; Young-hee Song; Myeong-Soon Park

Archive | 2005

Interconnection structure of integrated circuit chip

Se-young Jeong; Sung-min Sim; Soon-bum Kim; In-Young Lee; Young-hee Song

Archive | 2006

WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME

In Young Lee; Hyun-Soo Chung; Dong-Ho Lee; Sung-min Sim; Dong-Soo Seo; Seung-Kwan Ryu; Myeong-Soon Park

Archive | 2008

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Seung-Kwan Ryu; Hee-Kook Choi; Sung-min Sim; Dong-Hyeon Jang

Archive | 2006

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

In-Young Lee; Sung-min Sim; Dong-Hyeon Jang; Hyun-Soo Chung; Jae-Sik Chung; Seung-Kwan Ryu; Myeong-Soon Park; Jong-Kook Yoon; Ju-Il Choi

Archive | 2006

Method of forming metal lines and bumps for semiconductor devices

Soon-bum Kim; Sung-min Sim; Dong-Hyeon Jang; Jae-Sik Chung; Se-Yong Oh

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Collaboration

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Dong-Hyeon Jang

Samsung

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Young-hee Song

Samsung

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Hyun-Soo Chung

Samsung

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Myeong-Soon Park

Samsung

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In-Young Lee

Samsung

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Se-young Jeong

Samsung

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Seung-Kwan Ryu

Samsung

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Soon-bum Kim

Samsung

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Jae-Sik Chung

Samsung

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Kang-Wook Lee

Samsung

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