Theodoros Panagopoulos
Applied Materials
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Publication
Featured researches published by Theodoros Panagopoulos.
Applied Physics Letters | 2007
Edward V. Barnat; P. A. Miller; G. A. Hebner; Alex Paterson; Theodoros Panagopoulos; Edward P. Hammond; John L. Holland
The radial distribution of the measured voltage drop across a sheath formed between a 300mm electrode and an argon plasma discharge is shown to depend on the excitation radio frequency, under constant power and pressure conditions. At a lower frequency of 13.56MHz, the voltage drop across the sheath is uniform across the 300mm electrode, while at higher frequencies of 60 and 162MHz the voltage drop becomes radially nonuniform. The magnitude and spatial extent of the nonuniformity become greater with increasing frequency.
Plasma Sources Science and Technology | 2007
Edward V. Barnat; P. A. Miller; G. A. Hebner; Alex Paterson; Theodoros Panagopoulos; Edward P. Hammond; John Holland
The spatial structure and temporal evolution of the electric fields in a sheath formed in a dual frequency, 300 mm capacitive argon discharge are measured as functions of relative mixing between a low frequency current and a high frequency current. It is found that the overall structure of the sheath (potential across the sheath and the thickness of the sheath) are dominated by the lower frequency component while (smaller) oscillations in these quantities are dictated by the higher frequency component. Comparisons of the measured spatial and temporal profiles are made for Liebermans and Robiche et al sheath model and with a particle in a cell calculation.
Journal of Vacuum Science and Technology | 2006
Thomas J. Kropewnicki; Alex Paterson; Theodoros Panagopoulos; John Holland
The sputter etching of NiFe thin films by Ar ions in a rf plasma has been studied and characterized with the use of a Langmuir probe. The NiFe sputter etch rate was found to depend strongly on incident ion energy, with the highest NiFe etch rates occurring at high rf bias power, low pressure, and moderate rf source power. NiFe etch rates initially increased with increasing rf source power, then saturated at higher rf source powers. Pressure had the weakest effect on NiFe etch rates. Empirically determined sputter yields based on the NiFe etch rates and ion current densities were calculated, and these compared favorably to sputter yields determined using the sputtering model proposed by Sigmund [Phys. Rev. 184, 383 (1969)].
Archive | 2006
John Holland; Theodoros Panagopoulos
Archive | 2001
Chang Lin Hsieh; Jie Yuan; Hui Chen; Theodoros Panagopoulos; Yan Ye
Archive | 2008
Dan Katz; David Palagashvili; Brian K. Hatcher; Theodoros Panagopoulos; Valentin N. Todorow; Edward P. Hammond; Alexander Paterson; Rodolfo P. Belen
Archive | 2004
Steven Shannon; Dennis S. Grimard; Theodoros Panagopoulos; Daniel J. Hoffman; Michael G. Chafin; Troy S. Detrick; Alexander Paterson; Jingbao Liu; Taeho Shin; Bryan Pu
Archive | 2007
Alexander Paterson; John Holland; Theodoros Panagopoulos; Edward P. Hammond; Brian K. Hatcher; Valentin N. Todorow; Dan Katz
Archive | 2007
Alexander Matyushkin; Dennis Koosau; Theodoros Panagopoulos; John Holland
Archive | 2007
Alexander Matyushkin; Dan Katz; John Holland; Theodoros Panagopoulos; Michael D. Willwerth