Tim J. Corbett

Discrete die burn-in for nonpackaged die

Packaging for semiconductor logic devices

Universal wafer carrier for wafer level die burn-in

Directly bonded SIMM module

Semiconductor reliability test chip

Laser marking techniques

Directly bonded board multiple integrated circuit module

Method and structure for attaching a semiconductor die to a lead frame

Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor

Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die