Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Toshiki Nakamura is active.

Publication


Featured researches published by Toshiki Nakamura.


international electron devices meeting | 1999

A novel gate-offset NAND cell (GOC-NAND) technology suitable for high-density and low-voltage-operation flash memories

Shinji Satoh; Toshiki Nakamura; Ken Takeuchi; Hirohisa Iizuka; Riichiro Shirota

This paper describes a novel scaled and low-voltage-operation NAND EEPROM technology with a G_ate-O_ffset NAND C_ell (GOC-NAND), which is free from program disturbance in a self-boosted program. In GOC-NAND, novel source/drain engineering is introduced for the first time. The program disturbance is decreased by two decades of magnitude in 0.1 /spl mu/m generation, without area penalty and additional process steps. Furthermore, the program disturbance is not increased by scaling and low voltage operation. Therefore, GOC-NAND is indispensable technology for gigabit-scaled NAND EEPROMs.


international memory workshop | 2017

AEP-LDPC ECC with Error Dispersion Coding for Burst Error Reduction of 2D and 3D NAND Flash Memories

Toshiki Nakamura; Yoshiaki Deguchi; Ken Takeuchi

To improve the reliability of Triple-Level Cell (TLC) NAND flash memory, Advanced Error Prediction (AEP) low-density parity-check (LDPC) ECC with Error Dispersion Coding is proposed. In the conventional LDPC, error-correction capability is degraded due to burst errors [1]. To reduce burst errors and improve the error-correction capabilities of LDPC, this paper proposes Error Dispersion Coding (EDC) which reduces burst errors, decreases the worst bit-error rate (BER) of Upper/Middle/Lower pages, and finally extends the data-retention time of TLC NAND flash memory. By applying proposed EDC, in 3D-TLC NAND flash memory, the burst errors and the worst BER are decreased by 87% and 40%, respectively. As a result, the acceptable data-retention time is extended by 1.8 and 2.6 times in 2D and 3D-TLC NAND flash memory, respectively.


custom integrated circuits conference | 2017

12× bit-error acceptable, 300× extended data-retention time, value-aware SSD with vertical 3D-TLC NAND flash memories for image recognition

Yoshiaki Deguchi; Toshiki Nakamura; Atsuro Kobayashi; Ken Takeuchi

Value-Aware SSD with Vertical 3D-TLC (Triple-Level Cell) NAND flash for the image recognition is proposed to increase the acceptable bit-error rate (BER) by 12-times and extend the data-retention time by 300-times. In addition to the reliability improvement, the read time reduces by 26%. The proposed SSD combines new data-aware techniques with deep neural networks error tolerance. 10% BER of NAND flash is allowed while providing the accurate and fast image recognition. The design overhead in the SSD controller is negligibly small.


international symposium on circuits and systems | 2018

Data-Aware Partial ECC with Data Modulation of ReRAM with Non-volatile In-memory Computing for Image Recognition with Deep Neural Network

Atsuna Hayakawa; Toshiki Nakamura; Yoshiaki Deguchi; Kazuki Maeda; Ken Takeuchi


international symposium on circuits and systems | 2018

Layer-by-layer Adaptively Optimized ECC of NAND flash-based SSD Storing Convolutional Neural Network Weight for Scene Recognition

Keita Mizushina; Toshiki Nakamura; Yoshiaki Deguchi; Ken Takeuchi


international reliability physics symposium | 2018

Error elimination ECC by horizontal error detection and vertical-LDPC ECC to increase data-retention time by 230% and acceptable bit-error rate by 90% for 3D-NAND flash SSDs

Shun Suzuki; Yoshiaki Deguchi; Toshiki Nakamura; Kyoji Mizoguchi; Ken Takeuchi


international memory workshop | 2018

Error-Reduction Controller Techniques of TaOx-Based ReRAM for Deep Neural Networks to Extend Data-Retention Lifetime by Over 1700x

Yoshiaki Deguchi; Kazuki Maeda; Shun Suzuki; Toshiki Nakamura; Ken Takeuchi


european solid state device research conference | 2018

Endurance-based Dynamic V TH Distribution Shaping of 3D-TLC NAND Flash Memories to Suppress Both Lateral Charge Migration and Vertical Charge De-trap and Increase Data-retention Time by 2.7x

Shun Suzuki; Yoshiaki Deguchi; Toshiki Nakamura; Ken Takeuchi


custom integrated circuits conference | 2018

9.1x Error acceptable adaptive artificial neural network coupled LDPC ECC for charge-trap and floating-gate 3D-NAND flash memories

Toshiki Nakamura; Yoshiaki Deguchi; Ken Takeuchi


The Japan Society of Applied Physics | 2018

3D-TLC NAND Flash memory-based Value-Aware SSD for Image Recognition System with Deep Neural Network

Yoshiaki Deguchi; Toshiki Nakamura; Ken Takeuchi

Collaboration


Dive into the Toshiki Nakamura's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge