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Yakub Aliyu

Chartered Semiconductor Manufacturing

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Publication

Featured researches published by Yakub Aliyu.

Archive | 2000

Method to create a copper diffusion deterrent interface

Simon Chooi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Yi Xu

Archive | 2002

Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding

John Sudijono; Yakub Aliyu; Mei Sheng Zhou; Simon Chooi; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Yi Xu

Archive | 2002

Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding

Kwok Keung Paul Ho; Simon Chooi; Yi Xu; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy

Archive | 2000

Method to create copper traps by modifying treatment on the dielectrics surface

John Sudijono; Yakub Aliyu; Mei Sheng Zhou; Simon Chooi; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Yi Xu

Archive | 2000

Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads

Simon Chooi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Xu Yi

Archive | 2000

Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding

Kwok Keung Paul Ho; Yi Xu; Simon Chooi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy

Archive | 2000

Method of manufacturing embedded organic stop layer for dual damascene patterning

Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Yi Xu; Simon Chooi; Yakub Aliyu

Archive | 2001

Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence

Sudipto Ranendra Roy; Yi Xu; Simon Chooi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Paul Kwok Keung Ho; Subhash Gupta

Archive | 2004

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Simon Chooi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Subhash Gupta; Sudipto Ranendra Roy; Paul Kwok Keung Ho; Yi Xu

Archive | 2003

Apparatus and methods to clean copper contamination on wafer edge

Sudipto Ranendra Roy; Subhash Gupta; Simon Chooi; Xu Yi; Yakub Aliyu; Mei Sheng Zhou; John Sudijono; Paul Kwok Keung Ho

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Collaboration

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John Sudijono

Chartered Semiconductor Manufacturing

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Simon Chooi

Chartered Semiconductor Manufacturing

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Sudipto Ranendra Roy

Chartered Semiconductor Manufacturing

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Mei Sheng Zhou

Chartered Semiconductor Manufacturing

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Subhash Gupta

Chartered Semiconductor Manufacturing

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Paul Kwok Keung Ho

Chartered Semiconductor Manufacturing

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Yi Xu

Chartered Semiconductor Manufacturing

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Xu Yi

Chartered Semiconductor Manufacturing

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Daniel Yen

Chartered Semiconductor Manufacturing

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Kwok Keung Paul Ho

Chartered Semiconductor Manufacturing

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