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Yeong-Jyh Lin

TSMC

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Publication

Featured researches published by Yeong-Jyh Lin.

Archive | 2012

Methods for stud bump formation and apparatus for performing the same

Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Yi-Li Hsiao; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2015

Methods for controlling warpage in packaging

Chien Ling Hwang; Bor-Ping Jang; Hsin-Hung Liao; Yeong-Jyh Lin; Hsiao-Chung Liang; Chung-Shi Liu

Archive | 2014

WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME

Bor-Ping Jang; Yeong-Jyh Lin; Chien Ling Hwang; Chung-Shi Liu; Meng-Tse Chen; Ming-Da Cheng; Chen-Hua Yu

Archive | 2013

MECHANISMS FOR FORMING BONDING STRUCTURES

Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Bor-Ping Jang; Hsiao-Chung Liang; Chung-Shi Liu

Archive | 2016

Packaging through Pre-Formed Metal Pins

Chen-Hua Yu; Chien Ling Hwang; Yeong-Jyh Lin

Archive | 2015

Wafer-Level Underfill and Over-Molding

Bor-Ping Jang; Yeong-Jyh Lin; Chien Ling Hwang; Chung-Shi Liu

Archive | 2013

Semiconductor device having a boundary structure, a package on package structure, and a method of making

Chien Ling Hwang; Yeong-Jyh Lin; Bor-Ping Jang; Hsiao-Chung Liang

Archive | 2012

Apparatus for stud bump formation

Chien Ling Hwang; Yeong-Jyh Lin; Yi-Li Hsiao; Ming-Da Cheng; Tsai-Tsung Tsai; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2015

Semiconductor wafer device and manufacturing method thereof

Bor-Ping Jang; Chien Ling Hwang; Hsin-Hung Liao; Yeong-Jyh Lin

Archive | 2014

Methods for forming apparatus for stud bump formation

Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Yi-Li Hsiao; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

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Chien Ling Hwang

TSMC

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Chung-Shi Liu

TSMC

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Bor-Ping Jang

TSMC

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Chen-Hua Yu

TSMC

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Ming-Da Cheng

TSMC

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Mirng-Ji Lii

TSMC

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Yi-Li Hsiao

TSMC

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Hsin-Hung Liao

TSMC

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Tsai-Tsung Tsai

TSMC

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Hsiao-Chung Liang

TSMC

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