Yong Kong Siew
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Publication
Featured researches published by Yong Kong Siew.
symposium on vlsi technology | 2005
Wu Ping Liu; J.B. Tan; Wei Lu; Shyam Pal; Yong Kong Siew; Hai Cong; Bei Chao Zhang; Xian Bin Wang; Fan Zhang; Liang Choo Hsia
In this paper we report on the successful integration of a 90nm low-k full VIA-first dual damascene process architecture using carbon-doped-oxide (CDO) and SiC etch-stop-layer (ESL). One of the key features of the integration scheme is that the effects of photoresist poisoning have been eliminated by optimization of the low-k (k < 3.0) film stack deposition process. The mechanisms underlying photoresist poisoning have been investigated through detailed partition studies. Electrical yield and reliability data will be shown to demonstrate the performance of the overall integration approach.
Archive | 2000
Seng Keong Victor Lim; Young-Way Teh; Ting-Cheong Ang; Alex See; Yong Kong Siew
Archive | 2006
Johnny Widodo; Bei Chao Zhang; Tong Qing Chen; Yong Kong Siew; Fan Zhang; San Leong Liew; John Sudijono; Liang Choo Hsia
Archive | 2004
Hai Cong; Yong Kong Siew; Liang Choo Hsia
Archive | 2008
Beichao Zhang; Johnny Widodo; Juan Boon Tan; Yong Kong Siew; Fan Zhang; Haifeng Sheng; Wenhe Lin; Young Way Teh; Jinping Liu; V. Ho; Liang Choo Hsia
Archive | 2008
Lup San Leong; Yong Kong Siew; Liang Choo Hsia
Semiconductor international | 2003
Yong Kong Siew; Raymond Joy; Dennis Tan; Wuping Liu; Ravi Srivastava; Juan Boon Tan; Liang-Choo Hsia
Archive | 2008
Fan Zhang; Lup San Leong; Yong Kong Siew; Bei Chao Zhang
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics | 2003
Tong Qing Chen; Hai Cong; Wu Ping Liu; Yong Kong Siew; Yelehanka Ramachandramurthy Pradeep; Liang Choo Hsia; Rakesh Jaiswal; Alok Jain; Ivan Sim
Archive | 2001
Ting-Cheong Ang; Victor Seng Keong Lim; Alex See; Yong Kong Siew; Young-Way Teh
