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Dive into the research topics where Yu-Ku Lin is active.

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Featured researches published by Yu-Ku Lin.


Archive | 2005

Via structure and process for forming the same

Jung-Chih Tsao; Kei-Wei Chen; Ying-Jing Lu; Yu-Sheng Wang; Yu-Ku Lin


Archive | 2017

Backside illuminated image sensor and method of manufacturing the same

Shiu-Ko Jangjian; Chun Che Lin; Yu-Ku Lin; Ying-Lang Wang; Chuan-Pu Liu


Archive | 2004

Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process

Kei-Wei Chen; Jung-Chih Tsao; Chi-Wen Liu; Jchung-Chang Chen; Shih-Tzung Chang; Shih-Ho Lin; Yu-Ku Lin; Ying-Lang Wang


Archive | 2004

Test device and method for laser alignment calibration

Shih-Tzung Chang; Yu-Ku Lin; Shih-Ho Lin; Kei-Wei Chen; Ting-Chun Wang; Ching-hwan Su; Ying-Lang Wang


Archive | 1999

Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish

Hui-Ling Wang; Tong-Hua Kuan; Ying-Lang Wang; Yu-Ku Lin


Archive | 2013

Image sensor device and fabricating method thereof

Shiu-Ko Jangjian; Chih-Nan Wu; Chun Che Lin; Yu-Ku Lin


Archive | 2004

Electropolishing method for removing particles from wafer surface

Shih-Ho Lin; Chung-Chang Chen; Kei-Wei Chen; Shih-Tzung Chang; Chao-Lung Chen; Po-Jen Shih; Yu-Ku Lin; Ying-Lang Wang


Archive | 2002

Use of a capping layer to reduce particle evolution during sputter pre-clean procedures

Tao Cheng; Wen-Hsin Huang; Jiun-Pyng You; Lin-June Wu; Shih-Tzung Chang; Ming-Jei Lee; Chun-Chang Chen; Yu-Ku Lin; Tong-Hua Kuan; Ying-Lang Wang


Archive | 2004

Novel ECP method for preventing the formation of voids and contamination in vias

Kei-Wei Chen; Shih-Ho Lin; Chun-Chang Chen; Ching-hwan Su; Yu-Ku Lin; Ying-Lang Wang; De-dui Marvin Liao; Meng-chao Tzeng


Archive | 2013

Back side illumination (BSI) sensors, manufacturing methods thereof, and semiconductor device manufacturing methods

Shiu-Ko Jangjian; Chin-nan Wu; Chun Che Lin; Yu-Ku Lin

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