Hiroshi Kirihara | Researchain

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Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 2004

Adhesive sheet, semiconductor device and method for producing the same

Suzushi Furuya; Maiko Kaneda; Hiroyuki Kawakami; Hiroshi Kirihara; Michio Masuno; Takayuki Matsuzaki; Michio Uruno; 涼士古谷; 道夫増野; 道生宇留野; 広幸川上; 隆行松崎; 博桐原; 麻衣子金田

Archive | 2002

SEMICONDUCTOR ELEMENT SURFACE PROTECTING FILM AND SEMICONDUCTOR ELEMENT UNIT

Yoichi Hosokawa; Hiroshi Kirihara; Michio Uruno; 宇留野道生; 桐原博; 細川羊一

Archive | 2000

LOW-ELASTIC ADHESIVE, LOW-ELASTIC ADHESIVE MEMBER, SUBSTRATE FOR LOADING SEMICONDUCTOR HAVING LOW-ELASTIC ADHESIVE MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Yoichi Hosokawa; Hiroshi Kirihara; Michio Uruno; 道生宇留野; 博桐原; 羊一細川

Archive | 2003

Semiconductor element protecting material and semiconductor device

Hiroshi Kirihara; Michio Masuno; Michio Uruno; 道夫増野; 道生宇留野; 博桐原

Archive | 1998

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Yoshiyuki Tanabe; Yoshihiro Nomura; Hiroshi Kirihara; Youichi Hosokawa; Shinji Iioka; Satoru Yanagisawa

Archive | 1998

SEMICONDUCTOR DEVICE MANUFACTURED WITH DOUBLE-SIDED ADHESIVE FILM

Yoichi Hosokawa; Hiroshi Kirihara; Hiroyuki Kuritani; Yoshihiro Nomura; Yoshiyuki Tanabe; 弘之栗谷; 博桐原; 義行田辺; 羊一細川; 好弘野村

Archive | 2001

Semiconductor device, substrate for mounting semiconductor chip and manufacturing method therefor, and adhesive and double-sided adhesive film

Yoichi Hosokawa; Teiichi Inada; Akira Kageyama; Yasushi Kamishiro; Aizo Kaneda; Hiroshi Kirihara; Hiroyuki Kuritani; Yoshihiro Nomura; Yasushi Shimada; Takeo Tomiyama; Kazunori Yamamoto; 健男富山; 和徳山本; 靖島田; 晃景山; 弘之栗谷; 博桐原; 恭神代; 禎一稲田; 羊一細川; 好弘野村; 愛三金田

Archive | 2002