Hiroyuki Kuriya | Researchain

Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Hiroyuki Kuriya is active.

Explore More

Publication

Featured researches published by Hiroyuki Kuriya.

Archive | 2011

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Teiichi Inada; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya

Archive | 1993

Method of producing boards for printed wiring

Hiroyuki Kuriya; Shinsuke Hagiwara

Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 2001

Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device

Inada Teiichi; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya

Archive | 2000

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

Yuko Tanaka; Yasushi Shimada; Teiichi Inada; Hiroyuki Kuriya; Kazunori Yamamoto; Yasushi Kumashiro; Keiji Sumiya

Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 1992

Epoxy resin molding material for sealing of electronic component

Shinsuke Hagiwara; Hiroyuki Kuriya; Shigeki Ichimura

Archive | 2003

Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device

Yasushi Shimada; Yoshitaka Hirata; Hiroyuki Kuriya; Kazuhisa Otsuka; Masanori Yamaguchi; Yuichi Shimayama; Ken Madarame; Etsuo Mizushima; Yuusuke Kondou; Kazunori Yamamoto

Archive | 2004

Insulation material, film, circuit board and method of producing them

Yasushi Kumashiro; Yoshitaka Hirata; Shin Takanezawa; Yasushi Shimada; Kazuhisa Otsuka; Hiroyuki Kuriya; Kazunori Yamamoto

Archive | 2002

Manufacturing method of electronic circuit including multilayer circuit board

Hiroshi Okabe; Hirozi Yamada; Eriko Takeda; Kazunori Yamamoto; Hiroyuki Kuriya; Masanori Yamaguchi; Kazuhisa Otsuka; Yoshitaka Hirata; Yasushi Shimada

Explore More