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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Hiroyuki Kuriya is active.

Publication


Featured researches published by Hiroyuki Kuriya.


Archive | 2011

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Teiichi Inada; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya


Archive | 1993

Method of producing boards for printed wiring

Hiroyuki Kuriya; Shinsuke Hagiwara


Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 2001

Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device

Inada Teiichi; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya


Archive | 2000

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

Yuko Tanaka; Yasushi Shimada; Teiichi Inada; Hiroyuki Kuriya; Kazunori Yamamoto; Yasushi Kumashiro; Keiji Sumiya


Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 1992

Epoxy resin molding material for sealing of electronic component

Shinsuke Hagiwara; Hiroyuki Kuriya; Shigeki Ichimura


Archive | 2003

Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device

Yasushi Shimada; Yoshitaka Hirata; Hiroyuki Kuriya; Kazuhisa Otsuka; Masanori Yamaguchi; Yuichi Shimayama; Ken Madarame; Etsuo Mizushima; Yuusuke Kondou; Kazunori Yamamoto


Archive | 2004

Insulation material, film, circuit board and method of producing them

Yasushi Kumashiro; Yoshitaka Hirata; Shin Takanezawa; Yasushi Shimada; Kazuhisa Otsuka; Hiroyuki Kuriya; Kazunori Yamamoto


Archive | 2002

Manufacturing method of electronic circuit including multilayer circuit board

Hiroshi Okabe; Hirozi Yamada; Eriko Takeda; Kazunori Yamamoto; Hiroyuki Kuriya; Masanori Yamaguchi; Kazuhisa Otsuka; Yoshitaka Hirata; Yasushi Shimada

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