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Wolfgang Buchholtz

Advanced Micro Devices

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Publication

Featured researches published by Wolfgang Buchholtz.

Archive | 2005

Semiconductor device including semiconductor regions having differently strained channel regions and a method of manufacturing the same

Manfred Horstmann; Ekkehard Pruefer; Wolfgang Buchholtz

Archive | 2007

Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain

Sven Beyer; Manfred Horstmann; Patrick Press; Wolfgang Buchholtz

Archive | 2005

Technique for forming a substrate having crystalline semiconductor regions of different characteristics

Wolfgang Buchholtz; Stephan Kruegel

Archive | 2005

Method of forming sidewall spacers

Markus Lenski; Wolfgang Buchholtz; Andy Wei; Michael Raab

Archive | 2005

Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity

Axel Preusse; Markus Keil; Wolfgang Buchholtz; Petra Hetzer; Elvira Buchholtz

Archive | 2008

Halbleiterbauelement mit NMOS- und PMOS-Transistoren mit eingebettetem Si/Ge-Material zum Erzeugen einer Zugverformung und einer Druckverformung

Wolfgang Buchholtz; Sven Beyer; Manfred Horstmann; Patrick Press

Archive | 2004

Formation of semiconductor structure by modifying first portion of material layer located over first transistor element, and performing etching process to remove modified first portion at greater etch rate than unmodified second portion

Wolfgang Buchholtz; Markus Lenski; Michael Raab; Andy Wei

Archive | 2005

Conductive structure e.g. metal line, forming method, involves performing heat treatment of locally restricted zone, and scanning locally heated zone to reduce number of grain boundaries in length direction of metal line

Wolfgang Buchholtz; Markus Keil; Axel Preusse

Archive | 2004

Halbleiterelement mit Halbleitergebieten, die unterschiedlich verformte Kanalgebiete aufweisen, und Verfahren zur Herstellung des Halbleiterelements

Wolfgang Buchholtz; Manfred Horstmann; Ekkehard Pruefer

Archive | 2009

Technique for forming interconnecting structures with reduced electro and stress migration and/or resistivity

Wolfgang Buchholtz; Petra Hetzer; Elvira Buchholtz; Axel Preusse; Markus Keil

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Collaboration

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Manfred Horstmann

Advanced Micro Devices

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Patrick Press

Advanced Micro Devices

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Axel Preusse

Advanced Micro Devices

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Ekkehard Pruefer

Advanced Micro Devices

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Markus Keil

Advanced Micro Devices

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Manfred Horstmann

Advanced Micro Devices

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Sven Beyer

GlobalFoundries

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Elvira Buchholtz

Advanced Micro Devices

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Markus Lenski

Advanced Micro Devices

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Michael Raab

Advanced Micro Devices

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