Cao Xi
Huawei
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Featured researches published by Cao Xi.
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2017
John H. Lau; Ming Li; Dewen Tian; Nelson Fan; Eric Kuah; Wu Kai; Margie Li; Jin Hao; Yiu Ming Cheung; Zhang Li; Kim Hwee Tan; Rozalia Beica; Tom Taylor; Cheng-Ta Ko; Henry Yang; Yu-Hua Chen; Sze Pei Lim; Ning Cheng Lee; Jiang Ran; Cao Xi; Koh Sau Wee; Qingxiang Yong
In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold cure and backgrinding of the EMC. The simulation results are compared to the experimental measurements. Also, the thermal performance (junction-to-ambient thermal resistance) of FOWLP with various chip thicknesses is characterized. Finally, some FOWLP important parameters affecting the warpage and thermal performances are recommended.
Journal of microelectronics and electronic packaging | 2017
John H. Lau; Ming Li; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Tony Chen; Iris Xu; Margie Li; Yiu Ming Cheung; Wu Kai; Ji Hao; Rozalia Beica; Tom Taylor; Cheng-Ta Ko; Henry Yang; Yu-Ting Chen; Sze Pei Lim; Nc Lee; Jiang Ran; Koh Sau Wee; Qingxiang Yong; Cao Xi; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee
International Symposium on Microelectronics | 2017
Ming Li; Qingqian Li; John H. Lau; Nelson Fan; Eric Kuah; Wu Kai; Ken Cheung; Zhang Li; Kim Hwee Tan; Iris Xu; Dong Chen; Rozalia Beica; Cheng-Ta Ko; Henry Yang; Sze Pei Lim; Jiang Ran; Cao Xi
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018
Cheng-Ta Ko; Henry Yang; John H. Lau; Ming Li; Margie Li; Curry Lin; Jw Lin; Tony Chen; Iris Xu; Chieh-Lin Chang; Jhih-Yuan Pan; Hsing-Hui Wu; Qing Xiang Yong; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Wu Kai; Ji Hao; Rozalia Beica; Marc Lin; Yu-Hua Chen; Zhong Cheng; Koh Sau Wee; Jiang Ran; Cao Xi; Sze Pei Lim; Nc Lee
electronic components and technology conference | 2018
John H. Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Sandy Chen; Qing Xiang Yong; Kumar Janardhanan; Wu Kai; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Winsons Bao; Sze Pei Lim; Rozalia Beica; Cheng-Ta Ko; Cao Xi
electronic components and technology conference | 2018
John H. Lau; Ming Li; Lei Yang; Margie Li; Qing Xiang Yong; Zhong Cheng; Tony Chen; Iris Xu; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Penny Lo; Wu Kai; Ji Hao; Rozalia Beica; Koh Sau Wee; Jiang Ran; Cao Xi; Sze Pei Lim; Nc Lee; Cheng-Ta Ko; Henry Yang; Yh Chen; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018
John H. Lau; Ming Li; Lei Yang; Margie Li; Iris Xu; Tony Chen; Sandy Chen; Qing Xiang Yong; Janardhanan Pillai Madhukumar; Wu Kai; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Winsons Bao; Sze Pei Lim; Rozalia Beica; Cheng-Ta Ko; Cao Xi
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018
John H. Lau; Ming Li; Margie Li Qingqian; Tony Chen; Iris Xu; Qing Xiang Yong; Zhong Cheng; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Yiu Ming Cheung; Eric Ng; Penny Lo; Wu Kai; Ji Hao; Koh Sau Wee; Jiang Ran; Cao Xi; Rozalia Beica; Sze Pei Lim; Nc Lee; Cheng-Ta Ko; Henry Yang; Yu-Hua Chen; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2018
John H. Lau; Ming Li; Qingqian Margie Li; Iris Xu; Tony Chen; Zhang Li; Kim Hwee Tan; Qing Xiang Yong; Zhong Cheng; Koh Sau Wee; Rozalia Beica; Cheng-Ta Ko; Sze Pei Lim; Nelson Fan; Eric Kuah; Wu Kai; Yiu Ming Cheung; Eric Ng; Cao Xi; Jiang Ran; Henry Yang; Yh Chen; Nc Lee; Mian Tao; Jeffery C. C. Lo; Ricky Shi Wei Lee
International Symposium on Microelectronics | 2017
John H. Lau; Ming Li; Nelson Fan; Eric Kuah; Zhang Li; Kim Hwee Tan; Tony Chen; Iris Xu; Margie Li; Yiu Ming Cheung; Wu Kai; Ji Hao; Rozalia Beica; Tom Taylor; Cheng-Ta Ko; Henry Yang; Yh Chen; Sze Pei Lim; Nc Lee; Jiang Ran; Koh Sau Wee; Qingxiang Yong; Cao Xi; Mian Tao; Jeffery Lo; Ricky Lee
