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Dive into the research topics where Daniel A. Babbs is active.

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Featured researches published by Daniel A. Babbs.


Emerging Lithographic Technologies VIII | 2004

Step and Repeat UV nanoimprint lithography tools and processes

Ian M. Mcmackin; Jin Choi; Philip D. Schumaker; Van Nguyen; Frank Y. Xu; Ecron Thompson; Daniel A. Babbs; S. V. Sreenivasan; Michael P. C. Watts; Norman E. Schumaker

Step and FlashTM Imprint Lithography (S-FILTM) process is a step and repeat nano-replication technique based on UV curable low viscosity liquids. Molecular Imprints, Inc. (MII) develops commercial tools that practice the S-FIL process. The current status of the S-FIL tool and process technology is presented in this paper. The specific topics that are covered include: • Residual layer control • Etch process development • Patterning of lines, contacts and posts • CD control • Defect and process life • Alignment and magnification control


Emerging Lithographic Technologies VIII | 2004

Development of imprint materials for the Step and Flash Imprint Lithography process

Frank Y. Xu; Nicholas A. Stacey; Michael P. C. Watts; Van N. Truskett; Ian M. Mcmackin; Jin Choi; Philip Schumaker; Ecron Thompson; Daniel A. Babbs; S. V. Sreenivasan; C. Grant Willson; Norman E. Schumaker

The Step and Flash Imprint Lithography (S-FILTM) process is a step and repeat nano-replication technique based on UV curable low viscosity liquids. Molecular Imprints, Inc. (MII) develops commercial tools that practice the S-FIL process. This talk will present the imprint materials that have been developed to specifically address the issue of process life and defects. The S-FIL process involves field-to-field dispensing of low viscosity (<5 cps) UV cross-linkable monomer mixtures. The low viscosity liquid leads to important advantages that include: • Insensitivity to pattern density variations • Improved template life due to a lubricated template-wafer interface avoids “hard contact” between template and wafer • Possibility for lubricated (in-situ) high-resolution alignment corrections prior to UV exposure The materials that are optimal for use in the S-FIL process need to possess optimal wetting characteristics, low evaporation, no phase separation, excellent polymer mechanical properties to avoid cohesive failure in the cured material, low adhesion to the template, and high adhesion to the underlying substrate. Over 300 formulations of acrylate based monomer mixtures were developed and studied. The imprint materials were deemed satisfactory based on the process of surviving imprinting more than 1500 imprints without the imprints developing systematic or repeating defects. For the purpose of these process studies, printing of sub-100 nm pillars and contacts is used since they represent the two extreme cases of patterning challenge: pillars are most likely to lead to cohesive failure in the material; and contacts are most likely to lead to mechanical failure of the template structures.


Proceedings of SPIE - The International Society for Optical Engineering | 2003

Design and performance of a step and repeat imprinting machine

Ian M. Mcmackin; Philip Schumaker; Daniel A. Babbs; Jin Choi; Wenli Collison; S. V. Sreenivasan; Norman E. Schumaker; Michael P. C. Watts; Ronald D. Voisin

Molecular Imprints, Inc. (MII) has developed the ImprioTM 100, which is the first commercial step and repeat imprint lithography system with field-to-field alignment. This system is designed to implement the UV curable nano-replication capability of the Step and FlashTM Imprint Lithography (S-FILTM) process. To-date, the Imprio 100 system has demonstrated: 1) Full 200 mm wafer coverage with lithographically useful patterning; 2) Full wafer residual thickness control to enable practical etching (thickness variation < 50 nm, 3 sigma); 3) Field edge control compatible with 50 um kerf regions. 4) Multi-day CD uniformity measured on an analytical SEM < 2 nm, 3 sigma with no process adjustments; 5) Etch pattern transfer including break-through etch of residual material, followed by a bi-layer etch through thick planarization layers; 6) Initial level-to-level alignment target acquisition with accuracy of better than 100 nm. 7) Low air borne particle counts in tool microenvironment consistent with Class 0.1 while imprinting.


international microprocesses and nanotechnology conference | 2004

The impact of step and flash imprint lithography for nano-manufacturing applications

D. LeBrake; Michael P. C. Watts; Ian Matthew McMackin; Jin Choi; Philip Schumaker; Va Nguyen; Frank Xu; Ecron Thompson; Daniel A. Babbs; S. V. Sreenivasan; Nick Stacey

Summary form only given, as follows. Step and Flash Imprint Lithography (S-FILTM) process is a step and repeat nano-replication technique based on UV curable low viscosity liquids. Investigation by this group and others has shown that the resolution of replication by imprint lithography is limited only be the size of the structures that can be created on the template (mold). S-FIL uses field-to-field drop dispensing of the W curable liquids for the step and repeat patterning. This approach allows for nanomanufacturing of devices with widely varying pattern densities and complicated structures. There are numerous bio applications for imprint lithography. One of the more interesting is to imprint small posts to manage cell =-growth. Images will be shown of distortion free 100 to 60 nm posts that are replicated by SFIL processing. Process data for repeatability, process control, effects and etch pattern transfer of sub 100 nm posts and other features will also be shown.


international microprocesses and nanotechnology conference | 2003

Status of Step and Flash Imprint Lithography tools and processes

Jung Han Choi; Ian M. Mcmackin; Philip D. Schumaker; Van Nguyen; Frank Y. Xu; Daniel A. Babbs; S.V. Sreenivasan; Michael P. C. Watts; Norman E. Schumaker

The Step and Flash/sup TM/ Imprint Lithography (S-FIL/sup TM/) process is a step and repeat nanoreplication technique based on UV curable low viscosity liquids. This article discusses various process capability of S-FIL including imprint resolution and line edge roughness; field-to-field CD control; imprinted film thickness uniformity; process life and defect data; and overlay alignment accuracy.


Archive | 2004

Chucking system for modulating shapes of substrates

Byung Jin Choi; Ronald D. Voisin; Sidlgata V. Sreenivasan; Michael P. C. Watts; Daniel A. Babbs; Mario J. Meissl; Hillman L. Bailey; Norman E. Schumaker


Archive | 2006

Chucking system for nano-manufacturing

Daniel A. Babbs; Byung-Jin Choi; Anshuman Cherala


Archive | 2005

Method of retaining a substrate to a wafer chuck

Byung-Jin Choi; Anshuman Cherala; Daniel A. Babbs


Archive | 2004

Interferometric analysis method for the manufacture of nano-scale devices

Pawan Kumar Nimmakayala; Tom H. Rafferty; Alireza Aghili; Byung-Jin Choi; Philip D. Schumaker; Daniel A. Babbs; Van N. Truskett


Archive | 2005

Method of separating a mold from a solidified layer disposed on a substrate

Byung-Jin Choi; Anshuman Cherala; Yeong-jun Choi; Mario J. Meissl; Sidlgata V. Sreenivasan; Norman E. Schumaker; Xiaoming Lu; Ian M. Mcmackin; Daniel A. Babbs

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Byung-Jin Choi

University of Texas System

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Mario J. Meissl

University of Texas at Austin

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Ronald D. Voisin

University of Texas System

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Van N. Truskett

University of Texas System

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Frank Y. Xu

University of Texas System

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Ian M. Mcmackin

Air Force Research Laboratory

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