Darius L. Crenshaw

RF CMOS on high-resistivity substrates for system-on-chip applications

The use of a high-resistivity substrate extends the capability of standard digital CMOS technology to enable the integration of high-performance RF passive components. The impact of substrate resistivity on the key components of RF CMOS for system-on-chip (SoC) applications is discussed. The comparison includes the transistor, transmission line, inductor, capacitor and varactor, as well as the noise isolation. We also discuss the integration issues including latch-up and well-well isolation in a 0.35-/spl mu/m Cu metal pitch, 0.1-/spl mu/m-gate-length RF CMOS technology.

0.1 /spl mu/m RFCMOS on high resistivity substrates for system on chip (SOC) applications

This paper describes the impact of substrate resistivity on the key components of the radio frequency (RF) CMOS for the system on chip (SOC) applications. The comparison includes the transistor, inductor, capacitor, noise isolation, latch-up as well as the well-to-well isolation in a 0.1 /spl mu/m (physical gate length) CMOS technology.

A 65 nm CMOS technology for mobile and digital signal processing applications

This paper presents a 65 nm CMOS technology that achieves a logic density of 900 k-gates/mm/sup 2/ and a SRAM memory density of 1.4 Mb/mm/sup 2/ using a sub-0.49 /spl mu/m/sup 2/ bitcell. Key features of a low cost technology option for mobile products (MP) and a high performance technology option (HP) for DSP based applications are described.