Satyavolu Srinivas Papa Rao

MIM capacitors and methods for fabricating same

Dual damascene diffusion barrier/liner process with selective via-to-trench-bottom recess

Contact resistance reduction by new barrier stack process

Method to improve inductance with a high-permeability slotted plate core in an integrated circuit

Use of supercritical fluid for low effective dielectric constant metallization

Systems and methods that selectively modify liner induced stress

Integration of pore sealing liner into dual-damascene methods and devices

Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode

Partial plate anneal plate process for deposition of conductive fill material

Capacitor integration at top-metal level with a protection layer for the copper surface