David Hirsch Danovitch

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Featured researches published by David Hirsch Danovitch.

Archive | 1991

Optoelectronic assembly with alignment member

Gary Richard Carden; David Hirsch Danovitch; Eric M. Foster; William Walter Vetter

Archive | 1998

Method for building interconnect structures by injection molded solder and structures built

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Rajesh Shankerlal Patel; Stephen Roux; Carlos Juan Sambucetti; James L. Speidell

Archive | 2001

Bilayer wafer-level underfill

Stephen L. Buchwalter; David Hirsch Danovitch; Fuad Elias Doany; Claudius Feger; Peter A. Gruber; Revathi Iyengar; Nancy C. LaBianca

Archive | 2002

Hybrid molds for molten solder screening process

Steven A. Cordes; David Hirsch Danovitch; Peter A. Gruber; James L. Speidell; Joseph Zinter

Archive | 1998

Apparatus for transferring solder bumps and method of using

Guy D. Beaumont; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber

Archive | 1997

Direct chip attach for low alpha emission interconnect system

Guy Paul Brouillette; David Hirsch Danovitch; M. Liehr; William T. Motsiff; Judith Marie Roldan; Carlos Juan Sambucetti; Ravi F. Saraf

Archive | 1996

Interconnect for low temperature chip attachment

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Bruce Lee Humphrey; M. Liehr; William T. Motsiff; Carlos Juan Sambucetti

Archive | 2002

Method for direct chip attach by solder bumps and an underfill layer

Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; M. Liehr; Carlos Juan Sambucetti

Archive | 2000

Method for making interconnect for low temperature chip attachment

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Bruce Lee Humphrey; M. Liehr; William T. Motsiff; Carlos Juan Sambucetti

Archive | 2007