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William T. Motsiff

IBM

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Publication

Featured researches published by William T. Motsiff.

Archive | 1996

Personalization structure for semiconductor devices

Robert M. Geffken; William T. Motsiff; Ronald R. Uttecht

Archive | 2006

Adjustable self-aligned air gap dielectric for low capacitance wiring

Robert M. Geffken; William T. Motsiff

Archive | 2004

Crack stop for low k dielectrics

Timothy H. Daubenspeck; Jeffrey P. Gambino; Stephen E. Luce; Thomas L. McDevitt; William T. Motsiff; Mark J. Pouliot; Jennifer C. Robbins

Archive | 2002

Post-fuse blow corrosion prevention structure for copper fuses

Timothy H. Daubenspeck; Daniel C. Edelstein; Robert M. Geffken; William T. Motsiff; Anthony K. Stamper; Steven H. Voldman

Archive | 1997

Integrated pad and fuse structure for planar copper metallurgy

William T. Motsiff; Robert M. Geffken; Ronald R. Uttecht

Archive | 1994

Metallization composite having nickle intermediate/interface

Herbert Carl Cook; Paul Alden Farrar; Robert M. Geffken; William T. Motsiff; Adolf Ernest Wirsing

Archive | 2002

Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces

Douglas S. Armbrust; William F. Clark; William A. Klaasen; William T. Motsiff; Timothy D. Sullivan

Archive | 2001

Method and structure for a semiconductor fuse

Timothy H. Daubenspeck; William T. Motsiff; Jed H. Rankin

Archive | 2000

Apparatus and method for antifuse with electrostatic assist

William T. Motsiff; William R. Tonti; Richard Q. Williams

Archive | 2000

Copper pad structure

Wayne J. Howell; Ronald L. Mendelson; William T. Motsiff

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Timothy H. Daubenspeck

IBM

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Robert M. Geffken

IBM

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Anthony K. Stamper

IBM

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Jeffrey P. Gambino

IBM

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Jean E. Wynne

IBM

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Richard Q. Williams

IBM

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Baozhen Li

IBM

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Christopher D. Muzzy

IBM

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Dinesh Arvindlal Badami

IBM

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Gerald Matusiewicz

IBM

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