Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Guy Paul Brouillette is active.

Publication


Featured researches published by Guy Paul Brouillette.


electronic components and technology conference | 2004

Injection molded solder technology for Pb-free wafer bumping

Peter A. Gruber; D.-Y. Shih; Luc Belanger; Guy Paul Brouillette; David Danovitch; Valerie Oberson; Michel Turgeon; H. Kimura

A new wafer bumping technology is described that is especially suited for Pb-free applications. Although capable of using standard PbSn eutectic solder, IMS (injection molded solder) has been found to be especially suited for accommodating a wide range of Pb-free alloys with equal ease. The development of IMS technology was driven by the need to reduce wafer bumping costs while simultaneously addressing the conflicting demands of increasing wafer dimensions to 300 mm and decreasing bump and pitch dimensions below 75 /spl mu/m on 150 /spl mu/m centers. The IMS wafer bumping process uses a new head assembly that melts bulk solder alloys with precisely controlled compositions and dispenses the molten solder into multiple cavities of a wafer-sized mold plate. The mold plate is CTE matched to silicon and is reusable many times, thus reducing the per wafer bumping cost. In the process, a mold plate is scanned and filled with molten solder and inspected after solidification. Thereafter, the mold plate and device wafer are aligned and adjoined in a mirror image fashion for processing through a solder reflow furnace to transfer solder to the wafer. In this paper, early manufacturing challenges and solutions are described which allow IMS to be considered as an attractive technology for 300 mm Pb-free wafer bumping. Early process feasibility data for 200 mm wafer bumping are reviewed. Economical and environmental advantages are also discussed in relation to key process characteristics, such as solder waste reduction, use of low-cost bulk alloys, and others.


Archive | 1998

Method for building interconnect structures by injection molded solder and structures built

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Rajesh Shankerlal Patel; Stephen Roux; Carlos Juan Sambucetti; James L. Speidell


Archive | 2000

Method and apparatus for forming solder bumps

Guy Paul Brouillette; Peter A. Gruber; Frederic Maurer


Archive | 2004

Injection molded continuously solidified solder method and apparatus

Luc Belanger; Guy Paul Brouillette; Stephen L. Buchwalter; Peter A. Gruber; Hideo Kimura; Jean-Luc Landreville; Frederic Manurer; Marc Montminy; Valerie Oberson; Da-Yuan Shih; Stephane St-onge; Michel Turgeon; Takeshi Yamada


Archive | 2000

Low temperature solder column attach by injection molded solder and structure formed

Peter A. Gruber; Lannie R. Bolde; Guy Paul Brouillette; James H. Covell; David Danovitch; Chon C. Lei


Archive | 1998

Apparatus for transferring solder bumps and method of using

Guy D. Beaumont; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber


Archive | 1997

Direct chip attach for low alpha emission interconnect system

Guy Paul Brouillette; David Hirsch Danovitch; M. Liehr; William T. Motsiff; Judith Marie Roldan; Carlos Juan Sambucetti; Ravi F. Saraf


Archive | 1996

Interconnect for low temperature chip attachment

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Bruce Lee Humphrey; M. Liehr; William T. Motsiff; Carlos Juan Sambucetti


Archive | 2002

Method for direct chip attach by solder bumps and an underfill layer

Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; M. Liehr; Carlos Juan Sambucetti


Archive | 2000

Method for making interconnect for low temperature chip attachment

Daniel George Berger; Guy Paul Brouillette; David Hirsch Danovitch; Peter A. Gruber; Bruce Lee Humphrey; M. Liehr; William T. Motsiff; Carlos Juan Sambucetti

Researchain Logo
Decentralizing Knowledge