Dibyajat Mishra

Nanomagnetics for High-Performance, Miniaturized Power, and RF Components [Nanopackaging]

This article describes magnetic nanomaterials and the benefits they provide in system components using three examples-high-density inductors, antennas, and electromagnetic interference (EMI) isolation structures.

Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components

Miniaturization of passive components, while mounting them close to the active devices to form ultrathin high-performance power and RF modules, is a key enabler for next-generation multifunctional miniaturized systems. Traditional microscale materials do not lead to adequate enhancement in volumetric densities to miniaturize passive components as thin films or thin integrated passive devices. With these materials, component miniaturization also degrades performance metrics such as quality factor, leakage current, tolerance, and stability. Nanomaterials such as nanocomposite dielectrics and magneto-dielectrics, nanostructured electrodes, and the resulting thin-film components have the potential to address this challenge. This chapter describes the key opportunities in nanomaterials and nanostructures for power and RF passive components. The first part of this chapter describes the role of nanostructured materials for high-density capacitors and inductors in power modules. The second part of the chapter describes application of nanoscale materials as nanocomposite dielectrics and magneto-dielectrics with stable and high permeability and permittivity for miniaturized RF modules.

Nanomagnetic structures for inductive coupling and shielding in wireless charging applications

This paper presents materials modeling, design, processing, integration and characterization of a new class of nanomagnetic structures for coupling and shielding in wireless charging and power conversion applications. Wireless power transfer applications such as wireless charging, operating at 6.78 MHz, require high-performance magnetic materials for enhancing the coupling between transceiver and receiver coils as well as for suppressing electromagnetic interference (EMI) shielding. This research describes two novel magnetic structures for coupling inductors and ultra-thin EMI shields. A novel vertically aligned magnetic composite structure was demonstrated for the coupling inductor. This structure is shown to result in permeabilities of above 500 and loss tangent of 0.01, which enhances the coupling inductance by 3-5x at 6.78 MHz, and also enhances the power-transfer efficiency by 2x. The second part of this paper presents the modeling, design and fabrication of nanomagnetic structures for ultra-thin EMI shields in wireless power transfer applications. The ultra-thin EMI shields for wireless power transfer described in this research can achieve greater than 20dB attenuation at 6.78 MHz even for 3-5μm shield thickness.

3D IPAC — A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules

This paper describes an innovative 3D IPAC (Integrated Passive and Active Components) concept for ultra-miniaturized and highly-functional sub-systems, going beyond discrete passives and Integrated Passive Devices (IPDs). The 3D IPAC concept consists of an ultra-thin 3D structure made of low loss and ultra-thin glass substrates with small-diameter through-vias, and ultra-thin active devices and thin or thick passive films or thin discrete passives on both sides. The first part of the paper describes the benefits of the 3D IPAC concept. The second part of the paper describes a wireless power telemetry module for a bioelectronic system application, and provides proof-of-concept demonstrations for the thinfilm passive components as a building block in the 3D IPAC telemetry module.

System Scaling With Nanostructured Power and RF Components

The emergence of smartphones and other smart systems is driving new trends in electronics scaling that goes beyond transistors or active devices, to include all the system components such as packaging substrates, passive components, thermal structures, power sources, and the system interconnections. Current system components are at milliscale, creating a

A FIRST CRYPTOSYSTEM FOR SECURITY OF TWO-DIMENSIONAL DATA

10^{3}

Multilayered Ferromagnetic Polymer Composite Structures for High-Density Power Inductors

to

Nanomagnetic films and arrays for nonlinear devices in highly-integrated RF modules

10^{6}

Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections

scaling gap with the packaging interfaces at microscale, and transistors at nanodimensions. With current microstructured materials, component miniaturization also degrades performance metrics such as efficiency, tolerance or precision, thermal and frequency stability. Nanostructured materials and processes can potentially miniaturize these system components, while simultaneously enhancing the performance. These nanostructured components are assembled close to the active devices, resulting in ultraminiaturized and ultrathin systems with 3-D integration of passives with actives. This paper shows the impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems. Opportunities for nanostructured materials in improving the power density and efficiency of capacitors and inductors in power-supply modules are reviewed in the first part of the paper. The impact of nanostructured magnetic, dielectric and magneto-dielectric films on emerging RF subsystems is illustrated in the last part of the paper.

Magnetic losses in metal nanoparticle-insulator nanocomposites

In this paper, we present a novel technique for security of two-dimensional data with the help of cryptography and steganography. The presented approach provides multilayered security of two-dimensional data. First layer security was developed by cryptography and second layer by steganography. The advantage of steganography is that the intended secret message does not attract attention to itself as an object of scrutiny. This paper proposes a novel approach for encryption and decryption of information in the form of Word Data (.doc file), PDF document (.pdf file), Text document, Gray-scale images, and RGB images, etc. by using Vigenere Cipher (VC) associated with Discrete Fourier Transform (DFT) and then hiding the data behind the RGB image (i.e. steganography). Earlier developed techniques provide security of either PDF data, doc data, text data or image data, but not for all types of two-dimensional data and existing techniques used either cryptography or steganography for security. But proposed approach is suitable for all types of data and designed for security of information by cryptography and steganography. The experimental results for Word Data, PDF document, Text document, Gray-scale images and RGB images support the robustness and appropriateness for secure transmission of these data. The security analysis shows that the presented technique is immune from cryptanalytic. This technique further provides security while decryption as a check on behind which RGB color the information is hidden.