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Dustin P. Wood

Intel

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Publication

Featured researches published by Dustin P. Wood.

Archive | 2002

MULTILAYER CAPACITOR WITH MULTIPLE PLATES PER LAYER

Raymond Vieweg; Dustin P. Wood; Nicholas Holmberg

Archive | 2002

Metal core substrate packaging

John S. Guzek; Hamid Azimi; Dustin P. Wood

Archive | 2003

Integrated circuit packaging architecture

Dustin P. Wood; Brent Stone

Archive | 2007

Array capacitors with voids to enable a full-grid socket

Kaladhar Radhakrishnan; Dustin P. Wood; Nicholas Holmberg

Archive | 2005

Array capacitor for decoupling multiple voltage rails

Kaladhar Radhakrishnan; Nicholas Holmberg; Joel A. Auernheimer; Dustin P. Wood

Archive | 2001

Chip package with degassing holes

Dustin P. Wood

Archive | 2008

iTFC with optimized C(T)

Cengiz A. Palanduz; Dustin P. Wood

Archive | 2008

Integrated circuit packages, systems, and methods

Brent Stone; Dustin P. Wood; Kaladhar Radhakrishnan

Archive | 2016

Integrated circuit package substrate

Mathew J. Manusharow; Dustin P. Wood; Debendra Mallik

Archive | 2004

Array capacitor with IC contacts and applications

Kaladhar Radhakrishnan; Larry E. Mosley; Dustin P. Wood; Nicholas Holmberg

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Collaboration

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Nicholas Holmberg

Intel

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Kaladhar Radhakrishnan

Intel

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Joel A. Auernheimer

Intel

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Brent Stone

Intel

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Cengiz A. Palanduz

Intel

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Debendra Mallik

Intel

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John S. Guzek

Intel

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Fay Hua

Intel

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Hamid Azimi

Intel

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Ioan Sauciuc

Intel

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