Is this you? Create Your Porfile
Avatar

Evan E. Patton

IBM

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Evan E. Patton is active.

Explore More

Publication

Featured researches published by Evan E. Patton.

Archive | 1999

Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer

Jonathan D. Reid; Robert J. Contolini; Edward C. Opocensky; Evan E. Patton; Eliot K. Broadbent

Archive | 1998

Electric potential shaping apparatus for holding a semiconductor wafer during electroplating

Robert J. Contolini; Jonathan D. Reid; Evan E. Patton; Jingbin Feng; Steve Taatjes; John O. Dukovic

Archive | 1997

Electric potential shaping method for electroplating

Robert J. Contolini; Jonathan D. Reid; Evan E. Patton; Jingbin Feng; Steve Taatjes; John O. Dukovic

Archive | 2000

Copper electroplating apparatus

Steven T. Mayer; Evan E. Patton; Robert L. Jackson; Jonathan D. Reid

Archive | 1998

Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability

Jonathan D. Reid; Steven W. Taatjes; Robert J. Contolini; Evan E. Patton

Archive | 2000

Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element

Steven T. Mayer; Richard S. Hill; Alain Harrus; Evan E. Patton; Robert J. Contolini; Steve Taatjes; Jon Reid

Archive | 2002

Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources

Steven T. Mayer; Evan E. Patton; Brian Paul Blackman; Jonathan D. Reid; Thomas A. Ponnuswamy; Harold D. Perry

Archive | 2001

Clamshell apparatus for electrochemically treating wafers

Jonathan D. Reid; Steven T. Mayer; R. Marshall Stowell; Evan E. Patton; Jeff A. Hawkins

Archive | 2001

Methods and apparatus for controlled-angle wafer immersion

Jonathan D. Reid; Steven T. Mayer; Seshasayee Varadarajan; David Charles Smith; Evan E. Patton; Dinesh S. Kalakkad; Gary Lind

Archive | 2002

Copper electroplating method and apparatus

Steven T. Mayer; Evan E. Patton; Robert L. Jackson; Jonathan D. Reid

Explore More

Collaboration

Dive into the Evan E. Patton's collaboration.

Top Co-Authors
Avatar

Jonathan D. Reid

IBM

View shared research outputs
Top Co-Authors
Avatar

Steven T. Mayer

Lawrence Livermore National Laboratory

View shared research outputs
Top Co-Authors
Avatar

Robert J. Contolini

IBM

View shared research outputs
Top Co-Authors
Avatar

John O. Dukovic

IBM

View shared research outputs
Top Co-Authors
Avatar

Steve Taatjes

IBM

View shared research outputs
Top Co-Authors
Avatar

Jingbin Feng

IBM

View shared research outputs
Top Co-Authors
Avatar

David Charles Smith

Lam Research

View shared research outputs
Top Co-Authors
Avatar

Robert J. Contolini

IBM

View shared research outputs
Top Co-Authors
Avatar

Seshasayee Varadarajan

Lam Research

View shared research outputs
Top Co-Authors
Avatar

Erick G. Walton

IBM

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge