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Publication
Featured researches published by Felix P. Anderson.
MRS Proceedings | 2010
Jeff Gambino; Ed Cooney; Will Murphy; Cameron E. Luce; Steve Mongeon; Ning Lai; Bob Zwonik; Felix P. Anderson; Laura Schutz; Tom C. Lee; Tom McDevitt
A yield problem is observed with tungsten vias formed on copper interconnects. Copper migration can occur during chemical vapor deposition (CVD) of tungsten, if there are defects in the liner inside the via. Copper can react quickly with SiH 4 during the early stages of tungsten deposition, when SiH 4 -reduction of WF6 is used. Under severe conditions, large amounts of copper diffuse out of the underlying metal layer, resulting in copper silicide formation in the via and leaving voids in the copper wire. Copper migration can be minimized by reducing the time that the wafers are exposed to SiH 4 .
Archive | 2009
Felix P. Anderson; Thomas L. McDevitt; Anthony K. Stamper
Archive | 2009
Felix P. Anderson; Edward C. Cooney; Thomas L. McDevitt; Anthony K. Stamper
Archive | 2008
Felix P. Anderson; Anthony K. Stamper
Archive | 2007
Felix P. Anderson; Jeffrey P. Gambino; Thomas L. McDevitt; Anthony K. Stamper
Archive | 2013
Felix P. Anderson; Thomas L. McDevitt; Anthony K. Stamper
Archive | 2012
Felix P. Anderson; Timothy H. Daubenspeck; Jeffrey P. Gambino; Donald R. Letourneau; Thomas L. McDevitt
Archive | 2013
Felix P. Anderson; Zhong-Xiang He; Anthony K. Stamper
Archive | 2010
Felix P. Anderson; Zhong-Xiang He; Anthony K. Stamper; Eric J. White
Archive | 2009
Felix P. Anderson; Thomas L. McDevitt; Anthony K. Stamper
