Edward C. Cooney | Researchain

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international reliability physics symposium | 2014

Stress migration in a copper - Aluminum hybrid technology

Cathryn Christiansen; Jonathan D. Chapple-Sokol; Michael Coster; Douglas Hunt; Tom C. Lee; William J. Murphy; Jeffrey P. Gambino; Edward C. Cooney; Timothy W. Kemerer; Richard J. Rassel; Tony Stamper; Gregory U'Ren; Stephane Lariviere; Stephane Brandon

Stress migration (SM) time, temperature and process dependencies are investigated using a highly sensitive tungsten to copper interface combined with “plate-nose” and “mesh-nose” structures to accelerate the SM mechanism. Voids formed below the W via on the nose, and the resistance increases caused by these voids peaked at temperatures of 300-325°C. The effects of several copper line and tungsten via process steps are discussed. Process steps which modulated the Cu surface and Cu to via bottom interface had the largest effects.

Archive | 2005

Exposed pore sealing post patterning

Edward C. Cooney; John A. Fitzsimmons; Jeffrey P. Gambino; Stephen E. Luce; Thomas L. McDevitt; Lee M. Nicholson; Anthony K. Stamper

Archive | 1999

Fluorine barrier layer between conductor and insulator for degradation prevention

Edward C. Cooney; Hyun Koo Lee; Thomas L. McDevitt; Anthony K. Stamper

Archive | 2007

Device and methodology for reducing effective dielectric constant in semiconductor devices

Daniel C. Edelstein; Matthew E. Colburn; Edward C. Cooney; Timothy J. Dalton; John A. Fitzsimmons; Jeffrey P. Gambino; Elbert E. Huang; Michael Lane; Vincent J. McGahay; Lee M. Nicholson; Satyanarayana V. Nitta; Sampath Purushothaman; Sujatha Sankaran; Thomas M. Shaw; Andrew H. Simon; Anthony K. Stamper

Archive | 1997