Frederick C. Wu
Applied Materials
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Featured researches published by Frederick C. Wu.
international interconnect technology conference | 2001
Jeong Soo Byun; Hyoung Chan Ha; Frederick C. Wu; M. Menezes; J. Kopp; V. Nguyen; Avgerinos V. Gelatos; M. Kori
We have performed the defect characterization of Reactive Precleaning (RPC+), an in-Situ precleaning prior to PECVD TiCl/sub 4/-Ti deposition, compared its cleaning efficiency with HF wet cleaning, and evaluated thermal stability of the silicide. RPC+ was found to be a defect free cleaning process, and TiCl/sub 4/-Ti deposition with in-Situ RPC+ results in thicker silicide on the undoped, n/sup +/, and p/sup +/-Si substrate due to the interface cleanliness. It was observed by TEM and XRD that the Ti-silicide with RPC+ has highly textured C49 phase. Finally, RPC+ improves the thermal stability of the silicide.
Archive | 2006
Paul F. Ma; Kavita Shah; Dien-Yeh Wu; Seshadri Ganguli; Christophe Marcadal; Frederick C. Wu; Schubert S. Chu
Archive | 2001
Jeong Soo Byun; Lin Yin; Frederick C. Wu; Ramanujapuram A. Srinivas; Avgerinos V. Gelatos; Alfred Mak; Mei Chang; Moris Kori; Ashok K. Sinha
Archive | 2000
Ramanujapuram A. Srinivas; Brian Metzger; Shulin Wang; Frederick C. Wu
Archive | 2002
Ken K. Lai; Jeong Soo Byun; Frederick C. Wu; Ramanujapuran A. Srinivas; Avgerinos V. Gelatos; Mei Chang; Moris Kori; Ashok K. Sinha; Hua Chung; Hongbin Fang; Alfred Mak; Michael X. Yang; Ming Xi
Archive | 2001
Tong Zhang; Hyoung-Chan Ha; Jeong Soo Byun; Avgerinos V. Gelatos; Frederick C. Wu
Archive | 2006
Paul F. Ma; Kavita Shah; Dien-Yeh Wu; Seshadri Ganguli; Christophe Marcadal; Frederick C. Wu; Schubert S. Chu
Archive | 2006
Timothy W. Weidman; Arulkumar Shanmugasundram; Kapila Wijekoon; Schubert S. Chu; Frederick C. Wu; Kavita Shah
Archive | 1998
Ramanujapuram A. Srinivas; Frederick C. Wu; Anand Vasudev; Mei Chang; Lawrence D. Buckley; Li Wu; Brian Boyle; Shunichi Hizume; Patricia Jennings
Archive | 2006
Schubert S. Chu; Frederick C. Wu; Christophe Marcadal; Seshadri Ganguli; Dien-Yeh Wu; Kavita Shah; Paul F. Ma