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Dive into the research topics where Christophe Marcadal is active.

Publication


Featured researches published by Christophe Marcadal.


advanced semiconductor manufacturing conference | 1999

Characterization of copper CVD process by a process monitor

K.C. Lin; Christophe Marcadal; S. Ganguli; Bo Zheng; J. Schmitt; Ling Chen

The mass spectrometric technique for monitoring copper chemical vapor deposition process using Cu(hfac)(tmvs) has been investigated. Characterization of the process chemistry identified the main ionic species that could be used to monitor and study the process. Reactant flow rate and the mass spectrometric signal of TMVS was found to have linear relationship. The process monitor response time for the reactants and the product species was of the order of seconds. The reproducibility of the Cu CVD process was studied by using a process-monitoring recipe. This process monitoring technique has been used for tool and process optimization.


Archive | 2006

Apparatus and process for plasma-enhanced atomic layer deposition

Paul F. Ma; Kavita Shah; Dien-Yeh Wu; Seshadri Ganguli; Christophe Marcadal; Frederick C. Wu; Schubert S. Chu


Archive | 2001

Copper interconnect barrier layer structure and formation method

Ling Chen; Seshadri Ganguli; Christophe Marcadal; Wei Cao; Roderick Craig Mosely; Mei Chang


Archive | 2002

Reliability barrier integration for Cu application

Ming Xi; Paul Frederick Smith; Ling Chen; Michael X. Yang; Mei Chang; Fusen Chen; Christophe Marcadal; Jenny Lin


Archive | 2005

Method and apparatus of generating PDMAT precursor

Ling Chen; Vincent Ku; Hua Chung; Christophe Marcadal; Seshadri Ganguli; Jenny Lin; Dien-Yeh Wu; Alan Ouye; Mei Chang


Archive | 1999

CVD method of depositing copper films by using improved organocopper precursor blend

Ling Chen; Seshadri Ganguli; Bo Zheng; Samuel Wilson; Christophe Marcadal


Archive | 2000

Method of using a barrier sputter reactor to remove an underlying barrier layer

Ling Chen; Seshadri Ganguli; Wei Cao; Christophe Marcadal


Archive | 2002

Process for removing an underlying layer and depositing a barrier layer in one reactor

Ling Chen; Seshadri Ganguli; Wei Cao; Christophe Marcadal


Archive | 2005

Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA

Christophe Marcadal; Rongjun Wang; Hua Chung; Nirmalya Maity


Archive | 2003

Tantalum barrier layer for copper metallization

Ling Chen; Seshadri Ganguli; Wei Cao; Christophe Marcadal

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