Friedrich Paul Lindner

Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding

Low temperature direct bonding method of Cyclo-Olefin Polymer (COP) plates (20mm /spl times/ 40mm /spl times/ 2.0mm) has been developed employing surface plasma treatment with various gases such as N/sub 2/, O/sub 2/, and 10%-H/sub 2//Ar. Surface energy of the bonded interface has been measured by razor blade method. Reasonable bonding strength for flow devices was achieved even at room temperature. The contact angle measurement on the sample surfaces after plasma exposure indicated that the plasma activated surfaces became hydrophilic and this activated state lasted for longer than 2 months. This method is useful to fabricate micro-flow devices for single-molecule level optical bio-detection systems that requires less residual stress and deformation after bonding.

Heterogeneous substrates for high-temperature and optical applications

Further applications of MEMS require the combination of different materials in order to combine different functions in one and the same system. Besides conventional techniques (layer deposition methods) semiconductor wafer direct bonding is expected to be an effective method to produce heterogeneous materials. Different examples for optical and high-temperature applications are presented (Si-based heterostructures, Si/GaAs heterostructures).