Gilbert Hausmann

Chemical vapor deposition of barriers from novel precursors

Method of and apparatus for restoring a support surface in a semiconductor wafer processing system

Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing

Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system

Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

Method for improved sputter etch processing

Chemical vapor deposition of niobium barriers for copper metallization

Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck

Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same

Apparatus and method for actively controlling surface potential of an electrostatic chuck