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Featured researches published by Gong-Heum Han.


international solid-state circuits conference | 2014

25.1 A 3.2Gb/s/pin 8Gb 1.0V LPDDR4 SDRAM with integrated ECC engine for sub-1V DRAM core operation

Tae-Young Oh; Hoe-ju Chung; Young-Chul Cho; Jang-Woo Ryu; Ki-Won Lee; Changyoung Lee; Jin-Il Lee; Hyoung-Joo Kim; Min Soo Jang; Gong-Heum Han; Kihan Kim; Daesik Moon; Seung-Jun Bae; Joon-Young Park; Kyung-Soo Ha; Jae-Woong Lee; Su-Yeon Doo; Jung-Bum Shin; Chang-Ho Shin; Kiseok Oh; Doo-Hee Hwang; Tae-Seong Jang; Chul-Sung Park; Kwang-Il Park; Jung-Bae Lee; Joo Sun Choi

The recent revolution in handheld computing with high-speed cellular network made mobile processors have multi-cores and powerful 3D graphic engines that support FHD (1920×1080) or even higher resolutions. Consequently, the memory bandwidth requirement has also been increasing, requiring a next-generation mobile DRAM standard. In this paper, we present a power-efficient LPDDR4 SDRAM operating at 3.2Gb/s/pin. Our LPDDR4 DRAM offers 2× bandwidth with improved power efficiency over LPDDR3 SDRAMs, due to the 2-channel architecture and low-voltage-swing terminated logic (LVSTL) [1]. Moreover, the supply voltage is further reduced to 1.0V in this work, 0.1V lower than the LPDDR4 standard, for extra power saving.


symposium on vlsi circuits | 2004

64Mb mobile stacked single-crystal Si SRAM (S/sup 3/RAM) with selective dual pumping scheme (SDPS) and multi cell burn-in scheme (MCBS) for high density and low power SRAM

Hungjun An; Hyou-Youn Nam; Hyun-Sun Mo; Jong-Pil Son; Bo-Tak Lim; Sang-beom Kang; Gong-Heum Han; Joon-Min Park; Kyung-Hee Kim; Su-Yeon Kim; Choong-keun Kwak; Hyun-Geun Byun

A 64Mb Mobile S/sup 3/RAM was designed with stacked single-crystal thin film transistor (SSTFT) cell using 80nm SRAM technology to overcome chip size penalty of conventional 6T-SRAM with improved performance. For 1.3V operation, word line (WL) and cell Vcc were pumped simultaneously using selective dual pumping scheme (SDPS). Access time of 49.2ns was achieved at 1.3V supply voltage. Multi cell burn-in scheme (MCBS) and standby current (ISB1) repair scheme enhanced the yield for the high density products.


international solid-state circuits conference | 2017

23.4 An extremely low-standby-power 3.733Gb/s/pin 2Gb LPDDR4 SDRAM for wearable devices

Hye-Jung Kwon; Eunsung Seo; ChangYong Lee; Young-Hun Seo; Gong-Heum Han; Hye-Ran Kim; Jong-Ho Lee; Min-Su Jang; Sung-Geun Do; Seung-Hyun Cho; Jae-Koo Park; Su-Yeon Doo; Jung-Bum Shin; Sang-Hoon Jung; Hyoung-Ju Kim; In-Ho Im; Beob-Rae Cho; Jae-Woong Lee; Jae-Youl Lee; Ki-Hun Yu; Hyung-Kyu Kim; Chul-Hee Jeon; Hyun-Soo Park; Sang-Sun Kim; Seok-Ho Lee; Jong-Wook Park; Bo-Tak Lim; Jun-Young Park; Yoon-Sik Park; Hyuk-Jun Kwon

With the growth of wearable devices, such as smart watches and smart glasses, there is an increasing demand for lower power dissipation, to achieve longer battery life with limited battery capacity. Nevertheless, memory bandwidth needs to increase to support high-resolution graphic engines. Since most wearable devices are event driven, they consume a bulk of power in standby mode. Therefore, it is crictical to reduce standby-mode power, as well as improve active-mode power efficiency. However, DRAMs periodic self-refresh, critical for data retention, imposes a lower bound on standby-mode power. This paper presents a 2Gb LPDDR4 SDRAM with 0.15mW standby mode power, which is 66% lower than the standby power for a memory of the same density. The proposed memory also achieves a bandwidth of 3.733Gb/s/pin. To extremely reduce standby mode power, an in-DRAM error-correction-code (ECC) engine is used for self-refresh current reduction. Intensive power gating in deep-power-down (DPD) mode, a temperature controlled internal power generator and an aggressively increased gate length is also used to reduce leakage current. In addition, active-mode power efficiency is improved by using a dual-page-size scheme.


Archive | 2005

Semiconductor Memory Device and Method for Arranging and Manufacturing the Same

Gong-Heum Han; Hyou-Youn Nam; Bo-Tak Lim; Han-Byung Park; Soon-Moon Jung; Hoon Lim


Archive | 1998

Semiconductor memory device capable of operating at a low power supply voltage

Gong-Heum Han; Cheol-Sung Park; In-Cheol Shin


Archive | 2014

SEMICONDUCTOR MEMORY DEVICES, MEMORY SYSTEMS INCLUDING THE SAME AND METHOD OF WRITING DATA IN THE SAME

Hoi-Ju Chung; Chul-Sung Park; Jae-Wook Lee; Jang-Woo Ryu; Tae-Seong Jang; Gong-Heum Han


Archive | 2009

Semiconductor Memory Device Having Three Dimensional Structure

Gong-Heum Han; Hyou-Youn Nam; Bo-Tak Lim; Han-Byung Park; Soon-Moon Jung; Hoon Lim


Archive | 2006

Semiconductor memory device having reduced voltage coupling between bit lines

Gong-Heum Han; Chul-Sung Park; Hyung-Jin Kim; Byeong-Uk Yoo


Archive | 2005

Semiconductor memory device for low power consumption

Gong-Heum Han; Choong-keun Kwak; Joon-Min Park


Archive | 2002

Semiconductor memory device and test method therof

Gong-Heum Han; Choong-keun Kwak; Hyou-Youn Nam

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