Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Hai-Ching Chen is active.

Publication


Featured researches published by Hai-Ching Chen.


Archive | 2009

Liner formation in 3DIC structures

Ching-Yu Lo; Hung-Jung Tu; Hai-Ching Chen; Tien-I Bao; Wen-Chih Chiou; Chen-Hua Yu


Archive | 2011

Schemes for Forming Barrier Layers for Copper in Interconnect Structures

Chen-Hua Yu; Hai-Ching Chen; Tien-I Bao


Archive | 2013

Lithography Using High Selectivity Spacers for Pitch Reduction

Yu-Sheng Chang; Chung-Ju Lee; Cheng-Hsiung Tsai; Yung-Hsu Wu; Hsiang-Huan Lee; Hai-Ching Chen; Ming-Feng Shieh; Tien-I Bao; Ru-Gun Liu; Tsai-Sheng Gau; Shau-Lin Shue


Archive | 2013

Semiconductor devices and methods of forming same

Hsin-Yen Huang; Chi-Lin Teng; Hai-Ching Chen; Tien-I Bao


Archive | 2011

Structure and method for tunable interconnect scheme

Chung-Ju Lee; Tien-I Bao; Ming-Shih Yeh; Hai-Ching Chen; Shau-Lin Shue


Archive | 2008

High mechanical strength additives for porous ultra low-k material

Bo-Jiun Lin; Ching-Yu Lo; Hai-Ching Chen; Tien-I Bao; Chen-Hua Yu


Archive | 2010

Low dielectric constant material

Hsin-Yen Huang; Ching-Yu Lo; Hai-Ching Chen; Tien-I Bao


Archive | 2014

Semiconductor Integrated Circuit and Fabricating the Same

Hsin-Yen Huang; Yu-Sheng Chang; Hai-Ching Chen; Tien-I Bao


Archive | 2009

INTERCONNECT WITH FLEXIBLE DIELECTRIC LAYER

Ching-Yu Lo; Bo-Jiun Lin; Hai-Ching Chen; Tien-I Bao; Shau-Lin Shue; Chen-Hua Yu


Archive | 2015

Porogen Bonded Gap Filling Material in Semiconductor Manufacturing

Bo-Jiun Lin; Ching-Yu Chang; Hai-Ching Chen; Tien-I Bao

Collaboration


Dive into the Hai-Ching Chen's collaboration.

Researchain Logo
Decentralizing Knowledge