Hsin-Chieh Yao

Advanced patterning approaches for Cu/Low-k interconnects

The RC delay, electro migration (EM) and TDDB performance become more challenges to meet device requirement as continuous geometry shrink on BEOL dual damascene interconnects. To overcome these challenges from interconnect patterning point of view, we proposed Cu subtractive RIE as a potential solution for next generation Cu/Low-k interconnects.

A novel LWR reduction approach to enhance reliability performance in ultra-thin barrier/porous low-k (K<2.4) interconnect

This study evaluated plasma treatment processes on 193i and EUV photoresist to improve the line width roughness (LWR) performance in porous low-k/ultra-thin barrier Cu interconnect. We successfully demonstrated 20% LWR reduction for 193i PR and 11% for EUV PR. Furthermore, the influence of LWR on reliability was evaluated on 45nm line-width test vehicle. A boost of 10 times Time Dependent Dielectric Breakdown (TDDB) and 2 times Eelectrical Migration (EM) was demonstrated.